211473 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector; Applying energy for connecting; Compression bonding Ultrasonic bonding
Sub-classes:CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
#2METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING DEVICE
#3SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#4METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICONDUCTOR DEVICE AND RIBBON FOR USE THEREIN
#5Semiconductor devices and methods of manufacturing semiconductor devices
#6CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
#7SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SHAPED METAL BODY THAT IS ELECTRICALLY CONTACTED BY THE SEMICONDUCTOR
#8Semiconductor device comprising a composite material clip
#9Semiconductor module and conductive member for semiconductor module including cut in bent portion
#10Electrode terminal, semiconductor device, and power conversion apparatus
#11Semiconductor device
#12Electronic module comprising fluid cooling channel and method of manufacturing the same
#13Power module and method of manufacturing power module
#14Semiconductor apparatus
#15Semiconductor device
#16Monolithic power converter package
#17Monolithic Power Converter Package with Through Substrate vias
#18Small-Outline Package for a Power Transistor
#19Semiconductor device
#20SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
#21Semiconductor device
#22Stacked multi-die electronic device with interposed electrically conductive strap
#23Semiconductor device
#24SEMICONDUCTOR DEVICE
#25BONDING STRUCTURE AND METHOD
#26Semiconductor device attached to island having protrusion
#27Method for interconnecting electrical device to a module
#28Power semiconductor module
#29SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#30Semiconductor device and method of manufacturing the same
#31Semiconductor device and method of manufacturing the same
#32Power semiconductor module and method for operating a power semiconductor module
#33SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#34ULTRASONIC BONDING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
#35Semiconductor device
#36FLIP-CHIP CHIP-SCALE PACKAGE STRUCTURE
#37SEMICONDUCTOR DEVICE
#38Semiconductor module and method
#39Semiconductor device
#40SEMICONDUCTOR DEVICE
#41METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND ULTRASONIC BONDING APPARATUS
#42Electronic module having a multi-layer conductor for reducing its resistivity and a method of assembling such a module
#43Semiconductor device and manufacturing method of the same
#44Metal foil interconnection of electrical devices
#45Semiconductor device
#46SEMICONDUCTOR APPARATUS
#47Semiconductor device including a coupling conductor having a concave and convex
#48Semiconductor device with welded leads and method of manufacturing the same
#49SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD
#50Semiconductor device
#51Semiconductor apparatus manufacturing method
#52Integrated circuit package system including ribbon bond interconnect
#53Semiconductor device and method of manufacturing the same
#54Semiconductor device
#55Die attach material for TBGA or flexible circuitry
#56Semiconductor device with semiconductor chip mounted in package
#57Semiconductor device
#58Ultrasonic bonding equipment for manufacturing semiconductor device, semiconductor device and its manufacturing method
#59Die attach material for TBGA or flexible circuitry
#60Semiconductor device
#61Semiconductor device and method of manufacturing the same
#62Semiconductor device
#63Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package