ClassID:

211515

H01L2224/84805 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector; Bonding techniques; Soldering or alloying involving forming a eutectic alloy at the bonding interface

Recent Application in this class: