H01L2224/848 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector Bonding techniques

• H01L2224/84801 » Soldering or alloying 579
• H01L2224/8484 » Sintering 49
• H01L2224/8485 » using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester 260
• H01L2224/8489 » using an inorganic non metallic glass type adhesive, e.g. solder glass 0
• H01L2224/84893 » Anodic bonding, i.e. bonding by applying a voltage across the interface in order to induce ions migration leading to an irreversible chemical bond 2
• H01L2224/84895 » Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces 0
• H01L2224/84899 » Combinations of bonding methods provided for in at least two different groups from to 1

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