H01L2224/8482 - CPC Classification Index

ClassID:

211518 ⎘

H01L2224/8482 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector; Bonding techniques; Soldering or alloying Diffusion bonding

Sub-classes:

H01L2224/84825 » Solid-liquid interdiffusion 6
H01L2224/8483 » Solid-solid interdiffusion 0

Recent Application in this class:

20150194372

Semiconductor apparatus

20130256856

Multichip power semiconductor device

20130161801

Module including a discrete device mounted on a DCB substrate

20080150105

Power semiconductor component stack using lead technology with surface-mountable external contacts and a method for producing the same

20070176293

Semiconductor device having tin-based solder layer and method for manufacturing the same

20060049521

Semiconductor device having tin-based solder layer and method for manufacturing the same