211526 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector; Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester; Hardening the adhesive by curing, i.e. thermosetting Heat curing
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
#2Semiconductor device and manufacturing method thereof
#3Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
#4Methods of packaging a semiconductor die and package formed by the methods