ClassID:

211534

H01L2224/8489 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector; Bonding techniques using an inorganic non metallic glass type adhesive, e.g. solder glass