ClassID:

211539

H01L2224/84899 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector; Bonding techniques Combinations of bonding methods provided for in at least two different groups from  - 

Recent Application in this class: