211548 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector; Post-treatment of the connector or bonding area Applying permanent coating, e.g. protective coating
METHOD OF FORMING A DIE PACKAGE AND DIE PACKAGE ARRANGEMENT
#2Power semiconductor package and method for fabricating a power semiconductor package
#3Method for electrically contacting a component by galvanic connection of an open-pored contact piece, and corresponding component module
#4Semiconductor module and conductive member for semiconductor module including cut in bent portion
#5Electrode connection structure and electrode connection method
#6Method for electrophoretically depositing a film on an electronic assembly
#7Semiconductor device and method of manufacturing the same
#8Semiconductor device having a sealant layer including carbon directly contact the chip and the carrier