H01L2224/84909 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector Post-treatment of the connector or bonding area

• H01L2224/8491 » Cleaning, e.g. oxide removal step, desmearing 4
• H01L2224/8492 » Applying permanent coating, e.g. protective coating 7
• H01L2224/8493 » Reshaping e.g. for severing the strap, modifying the loop shape 1
• H01L2224/84948 » Thermal treatments, e.g. annealing, controlled cooling 0
• H01L2224/84951 » Forming additional members, e.g. for reinforcing 2