211650 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Bonding interfaces outside the semiconductor or solid-state body; Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
Sub-classes:Pre-molded substrate, method of manufacturing pre-molded substrate, and hollow type semiconductor device
#2Camera module and electronic device
#3Semiconductor device having a protective material with a first pH formed around cooper wire bonds and aluminum pads for neutralizes a second pH of an outer encapsulant material
#4Camera module and electronic device
#5Apparatus for stud bump formation
#6Method for protecting copper wire bonds on aluminum pads of a semiconductor device from corrosion
#7SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#8Semiconductor device and manufacturing method thereof
#9Method of wire bonding over active area of a semiconductor circuit
#10SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#11Method of fabricating a semiconductor multi package module having an inverted package stacked over ball grid array (BGA) package
#12Method of wire bonding over active area of a semiconductor circuit
#13Method for making a semiconductor multi-package module having inverted wire bond carrier second package
#14Method for producing a chip-substrate connection
#15Method of wire bonding over active area of a semiconductor circuit
#16Method of wire bonding over active area of a semiconductor circuit
#17Method of wire bonding over active area of a semiconductor circuit
#18Method of wire bonding over active area of a semiconductor circuit
#19METHOD OF WIRE BONDING OVER ACTIVE AREA OF A SEMICONDUCTOR CIRCUIT
#20Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package
#21Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides
#22Method of fabricating a semiconductor multi-package module having a second package substrate with an exposed metal layer wire bonded to a first package substrate
#23System and method for venting pressure from an integrated circuit package sealed with a lid
#24Coolant cooled type semiconductor device
#25Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package
#26Method of fabricating a semiconductor stacked multi-package module having inverted second package
#27Method of fabricating a semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA)
#28Method for making a semiconductor multi-package module having inverted bump chip carrier second package
#29Method for making semiconductor multi-package module having inverted second package and including additional die or package stacked on second package
#30Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package
#31Compact system module with built-in thermoelectric cooling
#32Coolant cooled type semiconductor device
#33Mold assembly, method and a package stack via bottom-leaded plastic (BLP) packaging
#34Method for fabricating a semiconductor component with contacts situated at the underside
#35Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging
#36Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package
#37Coolant cooled type semiconductor device
#38Metal carrier (leadframe) for receiving and contact-connecting electrical and/or optoelectronic components