ClassID:

211661

H01L2224/85494 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Bonding interfaces outside the semiconductor or solid-state body; Material with a principal constituent of the material being a liquid not provided for in groups  -