H01L2224/8591 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Post-treatment of the connector or wire bonding area Cleaning, e.g. oxide removal step, desmearing

• H01L2224/85911 » Chemical cleaning, e.g. etching, flux 0
• H01L2224/85912 » Mechanical cleaning, e.g. abrasion using hydro blasting, brushes, ultrasonic cleaning, dry ice blasting, gas-flow 0
• H01L2224/85913 » Plasma cleaning 9
• H01L2224/85914 » Thermal cleaning, e.g. using laser ablation or by electrostatic corona discharge 0
• H01L2224/85917 » Electron beam cleaning 0
• H01L2224/85919 » Combinations of two or more cleaning methods provided for in at least two different groups from to 0

Recent Application in this class: