H01L2224/85914 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Post-treatment of the connector or wire bonding area; Cleaning, e.g. oxide removal step, desmearing Thermal cleaning, e.g. using laser ablation or by electrostatic corona discharge

• H01L2224/85916 » using a laser 0