H01L2224/85909 - CPC Classification Index

ClassID:

211695 ⎘

H01L2224/85909 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector Post-treatment of the connector or wire bonding area

Sub-classes:

H01L2224/8591 » Cleaning, e.g. oxide removal step, desmearing 2
H01L2224/8592 » Applying permanent coating, e.g. protective coating 1,3K
H01L2224/8593 » Reshaping e.g. for severing the wire, modifying the wedge or ball or the loop shape 19
H01L2224/85948 » Thermal treatments, e.g. annealing, controlled cooling 10
H01L2224/85951 » Forming additional members, e.g. for reinforcing 148

Recent Application in this class:

20220165700

Power semiconductor module and power converter

20220013460

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUCH ASSEMBLIES

20200243444

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUCH ASSEMBLIES

20180158778

Packaged semiconductor assemblies and methods for manufacturing such assemblies

20160293569

Semiconductor device manufacturing method

20140124960

Packaged semiconductor assemblies and methods for manufacturing such assemblies

20120273942

Flip-chip Mounting Structure and Flip-chip Mounting Method

20120241982

Packaged semiconductor assemblies and methods for manufacturing such assemblies

20110084402

Packaged semiconductor assemblies and methods for manufacturing such assemblies

20100308457

Semiconductor apparatus and manufacturing method of the same

20090072395

Semiconductor device and method for manufacturing the same

20090014858

Packaged semiconductor assemblies and methods for manufacturing such assemblies

20080241977

Semiconductor device with electrode pad having probe mark

20080009083

Semiconductor device with electrode pad having probe mark

20070262468

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

20070190693

Semiconductor chip package having an adhesive tape attached on bonding wires

20060108138

Semiconductor chip package having an adhesive tape attached on bonding wires

20050156327

Colored conductive wires for a semiconductor package

20050073056

Semiconductor device with electrode pad having probe mark