211706 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Post-treatment of the connector or wire bonding area; Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape by chemical means, e.g. etching
Die package with low electromagnetic interference interconnection
#2Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same
#3Mixed impedance leads for die packages and method of making the same
#4Electronic device having a lead with selectively modified electrical properties