211705 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Post-treatment of the connector or wire bonding area Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape
Sub-classes:DISPLAY SUBSTRATE, TILED DISPLAY PANEL AND DISPLAY DEVICE
#2Display substrate, tiled display panel and display device
#3Wire bonding methods and systems incorporating metal nanoparticles
#4Wire bonding methods and systems incorporating metal nanoparticles
#5Mixed impedance leads for die packages and method of making the same
#6Electronic device having a lead with selectively modified electrical properties
#7APPARATUS FOR FORMING ASYMMETRICAL ENCAPSULANT BEADS ON WIRE BONDS
#8ELECTRONIC COMPONENT ASSEMBLY HAVING PROFILED ENCAPSULATED BONDS
#9SEMICONDUCTOR CHIP STACKED STRUCTURE AND METHOD OF MANUFACTURING SAME
#10Assembly of electronic components
#11Method of wire bonding an integrated circuit die and a printed circuit board
#12METHOD OF REDUCING VOIDS IN ENCAPSULANT
#13METHOD OF FORMING ASSYMETRICAL ENCAPSULANT BEAD
#14Method of controlling satellite drops from an encapsulant jetter
#15Electronic component with wire bonds in low modulus fill encapsulant
#16Method of adhering wire bond loops to reduce loop height
#17ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT
#18Electronic device with wire bonds adhered between integrated circuits dies and printed circuit boards
#19Method of forming low profile wire bonds between integrated circuits dies and printed circuit boards
#20Methods of making microelectronic assemblies