211714 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Post-treatment of the connector or wire bonding area Thermal treatments, e.g. annealing, controlled cooling
Device and method for increasing the reliability of a power module
#2Method of manufacturing semiconductor device
#3WIRE BOND STRENGTHENING
#4Corrosion-resistant copper bonds to aluminum
#5Semiconductor device and method of manufacturing the same
#6Waterfall wire bonding
#7Integrated circuit including bond wire directly bonded to pad
#8WIREBONDING PROCESS
#9Apparatus and methods for forming wire bonds
#10Wire bonding method for copper interconnects in semiconductor devices