H01L2224/86009 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB] Pre-treatment of the connector or the bonding area

• H01L2224/8601 » Cleaning, e.g. oxide removal step, desmearing 0
• H01L2224/8603 » Reshaping 0
• H01L2224/86048 » Thermal treatment, e.g. annealing, controlled pre-heating or pre-cooling 0
• H01L2224/86051 » Forming additional members 0