ClassID:

211723

H01L2224/8601 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]; Pre-treatment of the connector or the bonding area Cleaning, e.g. oxide removal step, desmearing