H01L2224/86121 - CPC Classification Index

ClassID:

211745 ⎘

H01L2224/86121 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]; Aligning Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors

Sub-classes:

H01L2224/86122 » by detecting inherent features of, or outside, the semiconductor or solid-state body 0
H01L2224/8613 » using marks formed on the semiconductor or solid-state body 0
H01L2224/86132 » using marks formed outside the semiconductor or solid-state body, i.e. ?off-chip? 0

Recent Application in this class:

20200135688

2020-04-30

Apparatus and method for transferring semiconductor devices from a substrate and stacking semiconductor devices on each other

20180226376

2018-08-09

Apparatus and method for transfering semiconductor devices from a substrate and stacking semiconductor devices on each other