H01L2224/8612 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB] Aligning

• H01L2224/86121 » Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors 2
• H01L2224/86136 » involving guiding structures, e.g. spacers or supporting members 0
• H01L2224/86143 » Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium 0
• H01L2224/86148 » involving movement of a part of the bonding apparatus 0

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