H01L2224/86136 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]; Aligning involving guiding structures, e.g. spacers or supporting members

• H01L2224/86138 » the guiding structures being at least partially left in the finished device 0