ClassID:

211751

H01L2224/86143 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]; Aligning Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium