H01L2224/86148 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]; Aligning involving movement of a part of the bonding apparatus

• H01L2224/86149 » being the lower part of the bonding apparatus, i.e. holding means for the bodies to be connected, e.g. XY table 0
• H01L2224/86169 » being the upper part of the bonding apparatus, e.g. nozzle 0