H01L2224/868 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB] Bonding techniques

• H01L2224/86801 » Soldering or alloying 2
• H01L2224/8684 » Sintering 1
• H01L2224/8685 » using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester 4
• H01L2224/8689 » using an inorganic non metallic glass type adhesive, e.g. solder glass 1
• H01L2224/86893 » Anodic bonding, i.e. bonding by applying a voltage across the interface in order to induce ions migration leading to an irreversible chemical bond 0
• H01L2224/86895 » Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces 0
• H01L2224/86899 » Combinations of bonding methods provided for in at least two different groups from to 0