H01L2224/8685 - CPC Classification Index

ClassID:

211794 ⎘

H01L2224/8685 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]; Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester

Sub-classes:

H01L2224/86855 » Hardening the adhesive by curing, i.e. thermosetting 0
H01L2224/8688 » Hardening the adhesive by cooling, e.g. for thermoplastics or hot-melt adhesives 0
H01L2224/86885 » Combinations of two or more hardening methods provided for in at least two different groups selected from to , e.g. hybrid thermoplastic-thermosetting adhesives 0

Recent Application in this class:

20200035627

2020-01-30

Adhesive substrate, transfer device having adhesive substrate, and method for producing adhesive substrate

20180151536

2018-05-31

Chip-on film and display device including the same

20130187259

2013-07-25

Electronic device and a method for fabricating an electronic device

20120157804

2012-06-21

High-speed, high-resolution electrophysiology in-vivo using conformal electronics