211789 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]; Bonding techniques; Soldering or alloying Reflow soldering
High density interconnection of microelectronic devices
#2LOW COST CONNECTOR FOR HIGH SPEED, HIGH DENSITY SIGNAL DELIVERY
#3Semiconductor component with chip for the high-frequency range
#4High density interconnection of microelectronic devices