H01L2224/8682 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]; Bonding techniques; Soldering or alloying Diffusion bonding

• H01L2224/86825 » Solid-liquid interdiffusion 0
• H01L2224/8683 » Solid-solid interdiffusion 2