H01L2224/86935 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]; Post-treatment of the connector or the bonding area; Reshaping by heating means

• H01L2224/86939 » using a laser 0
• H01L2224/86945 » using a corona discharge, e.g. electronic flame off [EFO] 0