H01L2224/92122 - CPC Classification Index

ClassID:

211834 ⎘

H01L2224/92122 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups - ; Specific sequence of method steps; Connecting a surface with connectors of different types; Sequential connecting processes the first connecting process involving a bump connector

Sub-classes:

H01L2224/92124 » the second connecting process involving a build-up interconnect 61
H01L2224/92125 » the second connecting process involving a layer connector 1,6K
H01L2224/92127 » the second connecting process involving a wire connector 29

Recent Application in this class:

20250349751

INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME

20240071952

INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME

20190139817

Semiconductor packaging structure and process

20170345708

Semiconductor packaging structure and process

20150179607

Semiconductor packaging structure and process

20150048495

Adhesive for semiconductor, fluxing agent, manufacturing method for semiconductor device, and semiconductor device