211842 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups - ; Specific sequence of method steps; Connecting a surface with connectors of different types; Sequential connecting processes the first connecting process involving a build-up interconnect the second connecting process involving a wire connector
Semiconductor device assembly and method therefor
#2Semiconductor package
#3Chip package structure and manufacturing method thereof
#4Magnetic field sensor and method for making same
#5Magnetic field sensor and method for making same
#6Integrated circuit package including wire bond and electrically conductive adhesive electrical connections
#7Package-in-packages and methods of formation thereof