211838 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups - ; Specific sequence of method steps; Connecting a surface with connectors of different types; Sequential connecting processes the first connecting process involving a build-up interconnect
Sub-classes:Semiconductor package with embedded die and its methods of fabrication
#2Embedded package and method of manufacturing the same
#3SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#4Semiconductor device and manufacturing method thereof
#5Semiconductor package with embedded die and its methods of fabrication