211855 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups - ; Specific sequence of method steps; Connecting a surface with connectors of different types; Sequential connecting processes the first connecting process involving a wire connector the second connecting process involving a bump connector
PACKAGE COMPRISING A FIRST AND A SECOND SEMICONDUCTOR DIE, WHEREIN A GALVANIC COUPLING IS PROVIDED BETWEEN THOSE SEMICONDUCTOR DIES, AS WELL AS A CORRESPONDING METHOD
#2SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS
#3Semiconductor package structure and method for manufacturing the same
#4Chip package structure and manufacturing method thereof
#5Multi-die package with bridge layer
#6Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
#7Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
#8Methods for making multi-die package with bridge layer
#9Method of assembly semiconductor device with through-package interconnect
#10Resonant circuit including bump pads
#11Multi-die package with bridge layer and method for making the same
#12Semiconductor package having cascaded chip stack
#13Semiconductor package with a lead, package-on-package device including the same, and mobile device including the same
#14Stacked dies with wire bonds and method
#15Semiconductor device assembly with package interconnect extending into overlying spacer material, and associated systems, devices, and methods
#16Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#17Semiconductor device and manufacturing method of the same
#18Semiconductor device manufacturing method
#19Stacked type power device module
#20Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#21Copper Stud Bump Wafer Level Package
#22Semiconductor device
#23Semiconductor package and method of manufacturing the same
#24Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#25Face-to-face (F2F) hybrid structure for an integrated circuit
#26Semiconductor module having discrete components and method for producing the same