H01L2224/9512 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips Aligning the plurality of semiconductor or solid-state bodies

• H01L2224/95121 » Active alignment, i.e. by apparatus steering 18
• H01L2224/95136 » involving guiding structures, e.g. shape matching, spacers or supporting members 166
• H01L2224/95143 » Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium 15
• H01L2224/95148 » involving movement of a part of the bonding apparatus 5

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