211898 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips; Aligning the plurality of semiconductor or solid-state bodies Active alignment, i.e. by apparatus steering
Sub-classes:METHOD AND SYSTEM FOR DIE BONDING
#2BONDING METHOD, BONDING APPARATUS AND ARTICLE MANUFACTURING METHOD
#3SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE
#4PROCESSING APPARATUS FOR ELECTRONIC COMPONENT
#5SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
#6MANUFACTURING METHOD OF DISPLAY DEVICE AND HOLDING SUBSTRATE
#7Shift control method in manufacture of semiconductor device
#8Bonding apparatus incorporating variable force distribution
#9Shift control method in manufacture of semiconductor device
#10Display device and method of manufacturing the same
#11High speed handling of ultra-small chips by selective laser bonding and debonding
#12Batch bonding apparatus and bonding method
#13High speed handling of ultra-small chips by selective laser bonding and debonding
#14Display device and method of manufacturing the same
#15Method for transferring and placing a semiconductor device on a substrate
#16Method for simultaneously bonding multiple chips of different heights on flexible substrates using anisotropic conductive film or paste
#17Mounting device and mounting method
#18Transfer device with three machine bases and transfer method thereof
#19Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of FO-WLCSP
#20Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of Fo-WLCSP