ClassID:

211900

H01L2224/95123 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips; Aligning the plurality of semiconductor or solid-state bodies; Active alignment, i.e. by apparatus steering by applying a pressurised fluid flow, e.g. liquid or gas flow