211902 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips; Aligning the plurality of semiconductor or solid-state bodies; Active alignment, i.e. by apparatus steering by applying an electromagnetic field Electrowetting, i.e. by changing the surface energy of a droplet