ClassID:

211908

H01L2224/95147 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips; Aligning the plurality of semiconductor or solid-state bodies; Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium by molecular lock-key, e.g. by DNA

Recent Application in this class: