211937 ⎘
Details relating to assemblies covered by the group but not provided for in its subgroups; All the devices being of a type provided for in the same subgroup of groups - the devices not having separate containers the devices being of a type provided for in group; Stacked arrangements of devices Auxiliary carrier between devices, the carrier having no electrical connection structure
Multiple die package with adhesive/spacer structure and insulated die surface
#602Micropede stacked die component assembly
#603Adhesive/spacer island structure for multiple die package
#604Semiconductor device and manufacturing method of same
#605Overhang support for a stacked semiconductor device, and method of forming thereof
#606Wire bonding system and method of use
#607Flexible multi-chip module and method of making the same
#608Die with discrete spacers and die spacing method
#609Semiconducting device with stacked dice
#610Spacer die structure and method for attaching
#611Spacer die structure and method for attaching
#612Vertically stacked semiconductor device
#613Stacked electronic part
#614Integrated circuit with re-route layer and stacked die assembly
#615Semiconductor device package of stacked semiconductor chips with spacers provided therein
#616Semiconductor device and fabrication method for the same
#617Stack MCP
#618Stacked semiconductor device having mask mounted in between stacked dies
#619Stacked semiconductor device
#620Multiple die-spacer for an integrated circuit
#621Semiconductor apparatus
#622Structure of gold fingers
#623Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package
#624Multi-chip module and methods
#625Integrating passive components on spacer in stacked dies
#626Multiple chip package module having inverted package stacked over die
#627Stacked die semiconductor device
#628Chip adhesive
#629Multi-chip module
#630Method of using foamed insulators in three dimensional multichip structures
#631Easy-to-unseal packaging bag
#632Method for stacking chips within a multichip module package
#633Method for producing a multichip module and multichip module
#634Methods for assembling semiconductor devices in superimposed relation with adhesive material defining the distance adjacent semiconductor devices are spaced apart from one another
#635Multi-chip semiconductor package and fabrication method thereof
#636Semiconductor package with improved chip attachment and manufacturing method thereof
#637Back-to-back semiconductor device assemblies
#638Method for manufacturing semiconductor devices
#639Multiple stacked-chip packaging structure
#640Methods for securing vertically mountable semiconductor devices in back-to back relation
#641Fabrication of stacked microelectronic devices
#642Fabrication of stacked microelectronic devices
#643Multi-chip module having bonding wires and method of fabricating the same
#644Electronic device package
#645Multiple die stack apparatus employing T-shaped interposer elements
#646Manufacturing method for multichip module
#647Fabrication method for stacked multi-chip package
#648Electronic device package