211957 ⎘
Details relating to assemblies covered by the group but not provided for in its subgroups; All the devices being of a type provided for in the same subgroup of groups - the devices having separate containers the devices being of a type provided for in group the containers being in a stacked arrangement Shape of the containers
Sub-classes:ELECTRONIC PACKAGE
#2SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH
#3PACKAGE ON PACKAGE STRUCTURE
#4PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
#5ELECTRONIC PACKAGE
#6Semiconductor package dielectric susbtrate including a trench
#7ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#8Semiconductor package dielectric substrate including a trench
#9Package on package structure
#10Semiconductor structure
#11LED light source and method of manufacturing the same
#12Package structure and method of forming the same
#13Semiconductor assembly with package on package structure and electronic device including the same
#14Package on package structure
#15Dynamic random access memory (DRAM) mounts
#16Package on package structure
#17SEMICONDUCTOR DEVICE WITH EMBEDDED SEMICONDUCTOR DIE AND SUBSTRATE-TO-SUBSTRATE INTERCONNECTS
#18Semiconductor package and method of fabricating the same
#19Method for dicing integrated fan-out packages without seal rings
#20Semiconductor device
#21Semiconductor package having a molding layer including a molding cavity and method of fabricating the same
#22Dynamic random access memory (DRAM) mounts
#23ELECTRONIC ASSEMBLIES INCLUDING AN ELECTRONIC DEVICE MOUNTED ON A NON-PLANAR SUBSTRATE
#24Package structure and method of forming the same
#25Package structure and method of forming the same
#26Printable 3D electronic structure
#27Semiconductor assembly with package on package structure and electronic device including the same
#28Electronic assemblies including electronic devices mounted on non-planar subrates
#29Semiconductor device with embedded semiconductor die and substrate-to-substrate interconnects
#30Microelectronic package with stacked microelectronic units and method for manufacture thereof
#31Embedded die-down package-on-package device
#32Semiconductor packages with heat dissipation layers and pillars and methods for fabricating the same
#33Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line
#34Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication
#35Semiconductor device and method of manufacturing the same
#36Semiconductor device and manufacturing method of semiconductor device
#37Systems and methods for thermal dissipation
#38Microelectronic package with stacked microelectronic units and method for manufacture thereof
#39Semiconductor module for high pressure applications
#40Method of manufacturing stacked semiconductor package
#41Package structure having a laminated release layer and method for fabricating the same
#42Package on package arrangement and method
#43Semiconductor device
#44Package-on-package modules, electronic systems including the same, and memory cards including the same
#45No-flow underfill for package with interposer frame
#46Semiconductor device with embedded semiconductor die and substrate-to-substrate interconnects
#47Stack-type semiconductor package
#48Flexible stack packages, electronic systems including the same, and memory cards including the same
#49Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
#50Semiconductor package device
#51Manufacturing method of wafer level package
#52Embedded die-down package-on-package device
#53Microelectronic package with stacked microelectronic units and method for manufacture thereof
#543D stacked package structure and method of manufacturing the same
#55Semiconductor packages having a guide wall and related systems and methods
#56Semiconductor package and method of forming the same
#57Semiconductor package and method of fabricating the same
#58No-flow underfill for package with interposer frame
#59Microelectronic package with stacked microelectronic units and method for manufacture thereof
#60HIGH DENSITY PACKAGE INTERCONNECT WITH COPPER HEAT SPREADER AND METHOD OF MAKING THE SAME
#61PACKAGE AND METHOD FOR MANUFACTURING PACKAGE
#62Integrated circuit packaging system with interconnects and method of manufacture thereof
#63Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof
#64Integrated circuit packaging system with vertical interconnection and method of manufacture thereof
#65Stacked semiconductor package and method for manufacturing the same
#66Method of manufacture of integrated circuit packaging system with multi-tier conductive interconnects
#67SEMICONDUCTOR DEVICE, STACKED SEMICONDUCTOR DEVICE AND INTERPOSER SUBSTRATE
#68Semiconductor device and method for manufacturing the same
#69Stacked structure of semiconductor chips, memory card, and method of manufacturing stacked structure of semiconductor chips
#70Semiconductor device, stacked semiconductor device and interposer substrate
#71SEMICONDUCTOR PACKAGE HAVING ADVANTAGE FOR STACKING AND STACK-TYPE SEMICONDUCTOR PACKAGE
#72Stepped integrated circuit packaging and mounting
#73Stackable integrated circuit packaging
#74Semiconductor chip package and stacked module having a functional part and packaging part arranged on a common plane
#75Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly
#76Semiconductor package assembly, semiconductor package and forming method thereof