Patents-Review.com
ClassID:

211958 ⎘

H01L2225/1082 - CPC Classification

Classification description:

Details relating to assemblies covered by the group but not provided for in its subgroups; All the devices being of a type provided for in the same subgroup of groups  -  the devices having separate containers the devices being of a type provided for in group the containers being in a stacked arrangement; Shape of the containers for improving alignment between containers, e.g. interlocking features

Recent Application in this class:
#1
20250336899
2025-10-30

SEMICONDUCTOR PACKAGE, METHOD OF BONDING WORKPIECES AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

 #2
20250329695
2025-10-23

SEMICONDUCTOR PACKAGE AND METHOD OF BONDING WORKPIECES

 #3
20250096208
2025-03-20

SEMICONDUCTOR PACKAGE HAVING DIELECTRIC LAYER WITH STEP DIFFERENCE

 #4
20240387467
2024-11-21

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

 #5
20240153931
2024-05-09

SEMICONDUCTOR PACKAGE AND METHOD OF BONDING WORKPIECES

 #6
20240153930
2024-05-09

SEMICONDUCTOR PACKAGE, METHOD OF BONDING WORKPIECES AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

 #7
20240088056
2024-03-14

METHOD OF FORMING SEMICONDUCTOR DEVICE

 #8
20230395573
2023-12-07

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

 #9
20230180381
2023-06-08

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME

 #10
20230062411
2023-03-02

Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor package

 #11
20230041977
2023-02-09

3D HETEROGENEOUS INTEGRATIONS AND METHODS OF MAKING THEREOF

 #12
20230026177
2023-01-26

ENHANCED SEMICONDUCTOR STRUCTURES

 #13
20220320029
2022-10-06

Dummy structure of stacked and bonded semiconductor device

 #14
20220293575
2022-09-15

Secure semiconductor integration and method for making thereof

 #15
20220238498
2022-07-28

SEMICONDUCTOR PACKAGE AND THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT USING LIQUID IMMERSION COOLING SYSTEM BY PERFORATED INTERPOZER

 #16
20220223564
2022-07-14

Semiconductor package and method of manufacturing semiconductor package

 #17
20220208688
2022-06-30

Method of forming semiconductor device

 #18
20220037295
2022-02-03

Semiconductor package

 #19
20210242185
2021-08-05

Semiconductor structure and method for making thereof

 #20
20210217709
2021-07-15

Info structure and method forming same

 #21
20210050335
2021-02-18

Edge interconnect self-assembly substrate

 #22
20210013189
2021-01-14

Semiconductor package

 #23
20200227357
2020-07-16

Method of forming semiconductor device

 #24
20200144212
2020-05-07

Dummy structure of stacked and bonded semiconductor device

 #25
20200135665
2020-04-30

Info structure and method forming same

 #26
20200091086
2020-03-19

Alignment mark design for packages

 #27
20200013764
2020-01-09

Semiconductor package and method of fabricating the same

 #28
20200006225
2020-01-02

Semiconductor device and method of manufacture

 #29
20190333900
2019-10-31

Solution for reducing poor contact in InFO package

 #30
20190333862
2019-10-31

Method of forming semiconductor device

 #31
20190259714
2019-08-22

Info structure and method forming same

 #32
20190164892
2019-05-30

Stacked modules

 #33
20190148288
2019-05-16

Semiconductor device and method of manufacture

 #34
20190123015
2019-04-25

Printing module, printing method and system of forming a printed structure

 #35
20190096869
2019-03-28

Semiconductor packages and methods of manufacturing the same

 #36
20190067258
2019-02-28

Semiconductor package having a molding layer including a molding cavity and method of fabricating the same

 #37
20180374832
2018-12-27

Conductive wire through-mold connection apparatus and method

 #38
20180342489
2018-11-29

Semiconductor structure and a method of making thereof

 #39
20180286839
2018-10-04

Integrated fan-out structure with guiding trenches in buffer layer

 #40
20180096976
2018-04-05

Solution for reducing poor contact in InFO package

 #41
20180068937
2018-03-08

Semiconductor device and method of forming a PoP device with embedded vertical interconnect units

 #42
20180053753
2018-02-22

STACKABLE MOLDED PACKAGES AND METHODS OF MANUFACTURE THEREOF

 #43
20170345803
2017-11-30

Module stacking mechanism with integrated ground

 #44
20170317062
2017-11-02

Method of fabricating a semiconductor package

 #45
20170309603
2017-10-26

3DIC structure and method for hybrid bonding semiconductor wafers

 #46
20170287890
2017-10-05

Bonding structure between semiconductor device package

 #47
20170287845
2017-10-05

Alignment mark design for packages

 #48
20170256511
2017-09-07

Semiconductor packages and methods of manufacturing the same

 #49
20170250166
2017-08-31

Thermal performance structure for semiconductor packages and method of forming same

 #50
20170250139
2017-08-31

Alignment mark design for packages

 #51
20170229433
2017-08-10

Integrated fan-out structure with guiding trenches in buffer layer

 #52
20170229414
2017-08-10

Method for a stacked and bonded semiconductor device

 #53
20170194300
2017-07-06

THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHOD OF MAKING THE SAME

 #54
20170194299
2017-07-06

Package-on-package type semiconductor package and method of fabricating the same

 #55
20170194248
2017-07-06

Multi-layer semiconductor structure and methods for fabricating multi-layer semiconductor structures

 #56
20170162550
2017-06-08

Interconnect structures for assembly of semiconductor structures including at least one integrated circuit structure

 #57
20170162507
2017-06-08

Semiconductor structures for assembly in multi-layer semiconductor devices including at least one semiconductor structure

 #58
20170141094
2017-05-18

Microelectronic package with stacked microelectronic units and method for manufacture thereof

 #59
20170133354
2017-05-11

Integrated circuit process having alignment marks for underfill

 #60
20170125389
2017-05-04

Edge interconnect self-assembly substrate

 #61
20170117243
2017-04-27

Anchoring structure of fine pitch bva

 #62
20170077075
2017-03-16

Laser marking in packages

 #63
20170077074
2017-03-16

Method for manufacturing semiconductor package

 #64
20170040283
2017-02-09

Through package via (TPV)

 #65
20170025385
2017-01-26

Solid state drive package and data storage system including the same

 #66
20170012024
2017-01-12

Integrated fan-out structure with openings in buffer layer

 #67
20160372448
2016-12-22

Semiconductor structure and a method of making thereof

 #68
20160372433
2016-12-22

Methods of fabricating a semiconductor package

 #69
20160372392
2016-12-22

Jig for fabricating semiconductor device

 #70
20160351549
2016-12-01

Thermally enhanced face-to-face semiconductor assembly with built-in heat spreader and method of making the same

 #71
20160336299
2016-11-17

Semiconductor device and method of forming wire studs as vertical interconnect in FO-WLP

 #72
20160329307
2016-11-10

Integrated fan-out structure with guiding trenches in buffer layer

 #73
20160268236
2016-09-15

Fan-out pop stacking process

 #74
20160260694
2016-09-08

Laser marking in packages

 #75
20160247790
2016-08-25

Alignment in the packaging of integrated circuits

 #76
20160240509
2016-08-18

Semiconductor packages

 #77
20160225743
2016-08-04

Package-on-package type stack package and method for manufacturing the same

 #78
20160197063
2016-07-07

Semiconductor package with package-on-package stacking capability and method of manufacturing the same

 #79
20160181231
2016-06-23

Solution for reducing poor contact in info packages

 #80
20160049363
2016-02-18

Semiconductor device and method

 #81
20150303161
2015-10-22

Zero stand-off bonding system and method

 #82
20150255432
2015-09-10

Solution for reducing poor contact in info packages

 #83
20150187746
2015-07-02

Package on package devices and methods of packaging semiconductor dies

 #84
20150130041
2015-05-14

Semiconductor package and method of fabricating the same

 #85
20150123290
2015-05-07

Semiconductor packages having trench-shaped opening and methods for fabricating the same

 #86
20150102502
2015-04-16

Integrated fan-out structure with openings in buffer layer

 #87
20150069623
2015-03-12

Integrated fan-out structure with guiding trenches in buffer layer

 #88
20150069606
2015-03-12

Methods and apparatus for package on package devices

 #89
20150041979
2015-02-12

Method to enhance reliability of through mold via TMVA part on part POP devices

 #90
20150035146
2015-02-05

Through package via (TPV)

 #91
20150001725
2015-01-01

Bonding structure for forming a package on package (PoP) structure and method for forming the same

 #92
20140374922
2014-12-25

Alignment in the packaging of integrated circuits

 #93
20140367867
2014-12-18

Packaging methods and packaged semiconductor devices

 #94
20140347833
2014-11-27

Stacked electronic device

 #95
20140252657
2014-09-11

Package alignment structure and method of forming same

 #96
20140103527
2014-04-17

Semiconductor device and method of forming a PoP device with embedded vertical interconnect units

 #97
20140077364
2014-03-20

Semiconductor device having wire studs as vertical interconnect in FO-WLP

 #98
20130341786
2013-12-26

Package on package devices and methods of packaging semiconductor dies

 #99
20130292831
2013-11-07

Methods and apparatus for package on package devices

 #100
20130249074
2013-09-26

Stacked semiconductor package

 #101
20130221543
2013-08-29

Integrated circuit packaging system with interconnects

 #102
20130099387
2013-04-25

Microelectronic package with stacked microelectronic units and method for manufacture thereof

 #103
20120306102
2012-12-06

Integrated circuit packaging system with package stacking and method of manufacture thereof

 #104
20120306075
2012-12-06

Semiconductor package apparatus

 #105
20120299197
2012-11-29

SEMICONDUCTOR PACKAGES

 #106
20120286411
2012-11-15

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR MODULE USING THE SAME

 #107
20120261820
2012-10-18

ASSEMBLY OF STACKED DEVICES WITH SEMICONDUCTOR COMPONENTS

 #108
20120146229
2012-06-14

Integrated circuit packaging system with vertical interconnection and method of manufacture thereof

 #109
20120074566
2012-03-29

Package for semiconductor device including guide rings and manufacturing method of the same

 #110
20110284998
2011-11-24

Integrated circuit package system with offset stacked die

 #111
20110176280
2011-07-21

Stacked semiconductor package

 #112
20110147911
2011-06-23

Stackable circuit structures and methods of fabrication thereof

 #113
20110121454
2011-05-26

Stack semiconductor package and method for manufacturing the same

 #114
20110068481
2011-03-24

Package-on-package type semiconductor package

 #115
20110034045
2011-02-10

Stacking Technique for Circuit Devices

 #116
20110014802
2011-01-20

Vertically stackable sockets for chip modules

 #117
20100193926
2010-08-05

Integrated circuit package system with offset stacked die

 #118
20100072634
2010-03-25

Planar encapsulation and mold cavity package in package system

 #119
20100001391
2010-01-07

Integrated circuit package system with supported stacked die

 #120
20090243071
2009-10-01

Integrated circuit package system with stacking module

 #121
20090236731
2009-09-24

Stackable integrated circuit package system

 #122
20090236721
2009-09-24

Semiconductor device including a pressure-contact section

 #123
20090146284
2009-06-11

Molded Leadless Packages and Assemblies Having Stacked Molded Leadless Packages

 #124
20090067135
2009-03-12

Semiconductor package having socket function, semiconductor module, electronic circuit module and circuit board with socket

 #125
20080315386
2008-12-25

Semiconductor device

 #126
20080150114
2008-06-26

Stacking packages with alignment elements

 #127
20080036059
2008-02-14

Method for producing a module with components stacked one above another

 #128
20080036052
2008-02-14

Integrated circuit package system with supported stacked die

 #129
20080017955
2008-01-24

Integrated circuit package system with offset stacked die

 #130
20070263367
2007-11-15

Electronic subassembly, electronic assembly, and method for producing an electronic assembly

 #131
20070215380
2007-09-20

Semiconductor device and manufacture method thereof

 #132
20070132071
2007-06-14

Package module with alignment structure and electronic device with the same

 #133
20070031998
2007-02-08

Method and apparatus for removing encapsulating material from a packaged microelectronic device

 #134
20060055020
2006-03-16

Stackable ball grid array

 #135
20050230799
2005-10-20

Multi-chip module with embedded package and method for manufacturing the same

 #136
20050019983
2005-01-27

Method of manufacturing a stackable ball grid array

 #137
15138993
2017-05-30

3DIC structure and method for hybrid bonding semiconductor wafers