Packaged integrated circuit with interposing functionality and method for manufacturing such a packaged integrated circuit

PACKAGE STRUCTURE FOR ELECTRONIC ASSEMBLIES

Microelectronic assemblies having substrate-integrated perovskite layers

BACTERIAL CELLULOSE PAPER-BASED FLEXIBLE ELECTRONICS EMPLOYING NANOCRYSTALS

Via-trace structures

Methods of forming semiconductor packages having a die with an encapsulant

Multilayer structure and related method of manufacture for electronics

Wireless communication device

Resin composition for semiconductor package, prepreg and metal clad laminate using the same

Printed circuit board and semiconductor package including the same

Method of forming a semiconductor package

SEMICONDUCTOR SUBSTRATE AND PROCESSING METHOD THEREOF

Display device and chip-on-film structure thereof

Package structure and manufacturing method thereof

Articles including metallized vias

Power module

Phenol novolak resin, curable resin composition, and cured product thereof

REDISTRIBUTION SYSTEM WITH HOMOGENOUS NON-CONDUCTIVE STRUCTURE AND METHOD OF MANUFACTURE THEREOF

Electronic component device

SEMICONDUCTOR PACKAGE

Multi-layer substrate

Packaged electronic module and manufacturing method thereof

Resin sheet

Integrated circuit die having backside passive components and methods associated therewith

Semiconductor module and method of manufacturing semiconductor module

Display device and electronic apparatus

Robust mold integrated substrate

Circuit module

Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substrate

Semiconductor package structure and semiconductor module including the same

CHIP ON FILM PACKAGE STRUCTURE

Reconfigurable memory architectures

Antenna-in-package with frequency-selective surface structure

Organic interposer and method for manufacturing organic interposer

Semiconductor structure having counductive bump with tapered portions and method of manufacturing the same

Semiconductor package structure

Fibrillated liquid crystal polymer powder, method of producing fibrillated liquid crystal polymer powder, paste, resin multilayer substrate, and method of producing resin multilayer substrate

Wiring film, device transfer sheet, and textile type device

Electronic device package with recessed substrate for underfill containment

Semiconductor device and manufacturing method thereof

Package structure of fingerprint identification chip

Electronic module

Circuit board and semiconductor package using the same

Logic drive based on standardized commodity programmable logic semiconductor IC chips

Semiconductor package

Semiconductor package and method of fabricating the same

Power electronics assembly having an adhesion layer, and method for producing said assembly

Body-mountable device with a common substrate for electronics and battery

Semiconductor package with programmable signal routing

Electronic component mounting board, electronic device, and electronic module

Semiconductor device and method for supporting ultra-thin semiconductor die

Sheet material, metal mesh, wiring substrate, display device and manufacturing methods therefor

Electronic module with sealing resin

Prepreg, printed circuit board, semiconductor package, and method for producing printed circuit board

High density organic bridge device and method

Packaged electronic module and manufacturing method thereof

Printed circuit board and semiconductor package structure

Printed circuit board and semiconductor package structure

Printed circuit board and semiconductor package structure

Semiconductor device

Multilayer structure

Oxazine compound, composition and cured product

Semiconductor package device and method of manufacturing the same

Semiconductor package devices integrated with inductor

SYSTEM IN PACKAGE PROCESS FLOW

Multilayer substrate, electronic device, and a method for manufacturing a multilayer substrate

Stretchable electronic assembly

High temperature dielectric materials, method of manufacture thereof and articles comprising the same

Electronic device and method for fabricating the same

High resolution brain-electronics interface

SEMICONDUCTOR PACKAGE

Printed circuit board having insulating metal oxide layer covering connection pad

Method of fabricating packaging substrate

Coaxial vias

Wrap-around source/drain method of making contacts for backside metals

Resin substrate, component-mounted resin substrate, method of manufacturing resin substrate, and method of manufacturing component-mounted resin substrate

Three dimensional integrated circuit (3DIC) with support structures

Resin composition and prepreg, resin sheet, laminate, and printed circuit board

Resin circuit board and resin circuit board having component mounted thereon

Case, semiconductor device and manufacturing method of case

Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board

Resin composition and prepreg, resin sheet, laminate, and printed circuit board comprising same

Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them

Transient electronics using thermoresponsive materials

Semiconductor package and method of forming the same

Method and apparatus for forming contacts on an integrated circuit die using a catalytic adhesive

Package-on-package with cavity in interposer

Thermosetting resin composition for semiconductor package and prepreg using the same

Electronic circuit and method of manufacturing the same

Clips defining electrical pathway on a flexible sheet

Methods of forming package-on-package structures

Film sensors array and method

Substrateless integrated circuit packages and methods of forming same

Flexible electronic device containing electronic element and polymer nanosheet and method for manufacturing same

Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board

Fan-out semiconductor package

Fan-out semiconductor package

Conformal electronics including nested serpentine interconnects

Semiconductor package assembly

Extremely High Frequency Electronic Component

Semiconductor package and method of making the same

Semiconductor device, electronic device, method of manufacturing semiconductor device, and method of manufacturing electronic device

Semiconductor integrated circuit device

INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Land grid array (LGA) packaging of passive-on-glass (POG) structure

ELECTRONIC COMPONENT-MOUNTED BODY AND METHOD FOR MANUFACTURING SAME

Selective metallization of an integrated circuit (IC) substrate

Semiconductor package device and method of manufacturing the same

Prototyping of electronic circuits with edge interconnects

Interposer, module, and method of producing interposer

Semiconductor package device for power device

Electronic component built-in substrate and electronic component device

Package device

Substrate intermediary body, through-hole via electrode substrate, and through-hole via electrode formation method

Multilayer wiring substrate, display unit, and electronic apparatus

Circuit board having an asymmetric layer structure

Circuit board and method for manufacturing a circuit board

Manufacturing method of semiconductor package and manufacturing method of semiconductor device

Multilayer substrate, component mounted board, and method for producing component mounted board

Component carrier and method for manufacturing the same

Body-mountable device with a common substrate for electronics and battery

Interposer frame and method of manufacturing the same

Built-in-coil substrate and method for manufacturing the same

Archimedean spiral design for deformable electronics

Semiconductor package devices integrated with inductor

Semiconductor device and manufacturing method thereof

Photosensitive resin composition, photosensitive element, cured product, semiconductor device, method for forming resist pattern, and method for producing circuit substrate

Integrated circuit die having backside passive components and methods associated therewith

CHIP CARD SUBSTRATE AND METHOD OF FORMING A CHIP CARD SUBSTRATE

Semiconductor device and method of making wafer level chip scale package

Semiconductor package device including electromagnetic wave shield and method of manufacturing the same

Electronic device package and manufacturing method thereof

Support, adhesive sheet, laminated structure, semiconductor device, and method for manufacturing printed wiring board

Flexible substrate having a via-hole with a conductive material and a method for manufacturing the same

Interposer having a pattern of sites for mounting chiplets

Composite device with substrate and mounted component

Packaging substrate and electronic package having the same

Semiconductor device and method of forming ultra high density embedded semiconductor die package

Electronic package having a supporting board and package carrier thereof

Semiconductor assembly having anti-warping controller and vertical connecting element in stiffener

Electrical package including bimetal lid

Circuit substrate and semiconductor package structure

Electrical package including bimetal lid

Circuit board and manufacturing method thereof

Molding compound wrapped package substrate

Composition for the production of polyimide film for flexible board of photoelectronic device

Body-mountable device with a common substrate for electronics and battery

Semiconductor package, semiconductor device using the same and manufacturing method thereof

Multi-device flexible electronics system on a chip (SOC) process integration

Electronic apparatus and method for fabricating the same

Desmear with metalized protective film

Resin-impregnated boron nitride sintered body and use for same

Resin multilayer substrate and method of manufacturing the same

Microelectronic assemblies with cavities, and methods of fabrication

Electronic apparatus and method for fabricating the same

Plastic chassis for liquid cooled electronic components

Scalable fabrication techniques and circuit packaging devices

Chip package and fabrication method thereof

Wiring substrate

Printed wiring board with conductor post having multiple surface roughness and method for manufacturing the same

Wiring substrate with buried substrate having linear conductors

Polyarylene polymers

Semiconductor device

Functionalized boron nitride materials and methods for their preparation and use

Semiconductor package

Electronic apparatus and method for fabricating the same

Apparatus and semiconductor structure including a multilayer package substrate

Chip-on-film package and display device including the same

Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance

Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance

Chip carrier laminate with high frequency dielectric and thermomechanical buffer

Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance

Semiconductor device and manufacturing method thereof

Package substrate

Stacked microelectronic assembly with TSVS formed in stages and carrier above chip

Laminate substrates having radial cut metallic planes

Integrated circuit package with embedded bridge

Semiconductor structure having a conductive bump with a plurality of bump segments

Semiconductor packages

High density organic bridge device and method

Resin-impregnated boron nitride sintered body and use for same

Package including a semiconductor die and a capacitive component

Circuit substrate and semiconductor package structure

Electronic module having an electrically insulating structure with material having a low modulus of elasticity

Methods of fabricating tape film packages

Semiconductor structure including a substrate and a semiconductor chip with matching coefficients of thermal expansion

Substrateless integrated circuit packages and methods of forming same

Interposer substrate and method of manufacturing the same

Semiconductor structure and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Multi-layer package with integrated antenna

Wiring substrate and method for manufacturing the same

Electronic component and method for dissipating heat from a semiconductor die

Method of curing thermosetting resin composition, thermosetting resin composition, and prepreg, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used

Component-embedded board and method of manufacturing same

Package structure and methods of forming the same

Package on-package with cavity in interposer

Integrated device comprising high density interconnects in inorganic layers and redistribution layers in organic layers

Copper feature design for warpage control of substrates

Wiring substrate

Wiring board, mounting structure equipped with the wiring board, and method for manufacturing wiring board

Radio communication tag and method for manufacturing the same

Semiconductor device and manufacturing method thereof

Wiring board and method of manufacturing the same

Method of manufacturing circuit board and semiconductor package

Wiring substrate and method of making wiring substrate

Bottom package with metal post interconnections

Substrate design for semiconductor packages and method of forming same

Wiring substrate and semiconductor package

Wiring board having an opening with an angled surface

Semiconductor device including independent film layer for embedding and/or spacing semiconductor die

Flip-chip hybridisation of two microelectronic components using a UV anneal

Wiring substrate and semiconductor device

Integrated circuit package with embedded bridge

Electronic component-mounted structure, IC card and COF package

Printed wiring board and method for manufacturing printed wiring board

Electronic apparatus and method for fabricating the same

Electronic package, package carrier, and method of manufacturing package carrier

Method of fabricating a semiconductor structure having conductive bumps with a plurality of metal layers

Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure

Semiconductor package and method of fabricating the same

Semiconductor integrated circuit device

Power semiconductor module having pattern laminated region

Semiconductor packages and display devices including semiconductor packages

Semiconductor device and method of making wafer level chip scale package

Wire tail connector for a semiconductor device

Packaged semiconductor device having an embedded system

Semiconductor device and manufacturing method thereof

Conformal electronics including nested serpentine interconnects

Chip on film including different wiring pattern, flexible display device including the same, and method of manufacturing flexible display device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Apparatus related to an improved package including a semiconductor die

Package on-package with cavity in interposer

Semiconductor package and electronic system including the same

Semiconductor device and method of forming ultra high density embedded semiconductor die package

Component-embedded resin substrate

Built-in electronic component substrate and method for manufacturing the substrate

Stacked microelectronic assembly with TSVS formed in stages and carrier above chip

Three-dimensional structure in which wiring is provided on its surface

High density organic bridge device and method

Packaged nano-structured component and method of making a packaged nano-structured component

Wiring substrate having a plurality of connection terminals and a filling member provided therebetween

Method of manufacturing circuit board and chip package and circuit board manufactured by using the method

Circuit boards, methods of fabricating the same, and semiconductor packages including the circuit boards

Semiconductor packaging apparatus formed from semiconductor package including first and second solder balls having different heights

Resin composition

Semiconductor package including interposer with through-semiconductor vias

Semiconductor package including a substrate and an interposer

Flexible sized die for use in multi-die integrated circuit

Wiring substrate, method for manufacturing the wiring substrate, and semiconductor package

Method for manufacturing semiconductor package

Carrier and method for fabricating coreless packaging substrate

Copper feature design for warpage control of substrates

Wiring substrate and method of manufacturing the same

Semiconductor package, semiconductor device, and method for manufacturing semiconductor package

Semiconductor device and method for manufacturing the same

Wiring substrate having multiple core substrates

Wiring substrate and method for manufacturing wiring substrate

Fine-pitch package-on-package structures and methods for forming the same

Semiconductor package including an organic substrate and interposer having through-semiconductor vias

Interposer frame and method of manufacturing the same

Ball grid array package substrate with through holes and method of forming same

Tape film packages and methods of fabricating the same

Chip on film package including test pads and semiconductor devices including the same

Semiconductor device and method of making single layer substrate with asymmetrical fibers and reduced warpage

Wiring substrate including projecting part having electrode pad formed thereon

MICRO SURFACE MOUNT DEVICE PACKAGING

Micro surface mount device packaging

MULTI-PLY CIRCUIT BOARD WITH FIBER BUNDLES

Housing for a chip arrangement and a method for forming a housing

System in package process flow

System in package process flow

INTERPOSER, CIRCUIT BOARD MODULE, AND METHOD FOR MANUFACTURING INTERPOSER

PACKAGE SUBSTRATE WITH MESH PATTERN AND METHOD FOR MANUFACTURING THE SAME

HYBRID INTERPOSER

HIGH IO SUBSTRATES AND INTERPOSERS WITHOUT VIAS

SEMICONDUCTOR DEVICE

System in package and method of fabricating same

RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD

Interposer and electronic device using the same

THERMAL SUBSTRATE

Method and apparatuses for integrated circuit substrate manufacture

3D integration microelectronic assembly for integrated circuit devices

Conformal Coining of Solder Joints in Electronic Packages

BARRIER FILM FOR ELECTRONIC DEVICE, METHOD OF MANUFACTURE THEREOF, AND ARTICLES INCLUDING THE SAME

MULTILAYER RESIN SHEET AND METHOD FOR PRODUCING THE SAME, METHOD FOR PRODUCING CURED MULTILAYER RESIN SHEET, AND HIGHLY THERMALLY CONDUCTIVE RESIN SHEET LAMINATE AND METHOD FOR PRODUCING THE SAME

Semiconductor device and method of forming IPD on molded substrate

Anisotropic conductor, method of producing the same, and anisotropic conductor-arranged sheet

ADHESIVE FILM LAYER FOR PRINTED CIRCUIT BOARD APPLICATIONS

Stacked microelectronic assemby with TSVS formed in stages and carrier above chip

Printed circuit board incorporating fibers

SEMICONDUCTOR PACKAGE AND IMPLEMENTATION STRUCTURE OF SEMICONDUCTOR PACKAGE

Method and Apparatus for Improving Substrate Warpage

Wiring board and method for manufacturing the same

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE

Resin composition and semiconductor device produced by using the same

INSULATING CIRCUIT BOARD, INVERTER DEVICE AND POWER SEMICONDUCTOR DEVICE

Semiconductor package and method for manufacturing the same

MULTILAYERED POLYIMIDE FILM

Semiconductor package and manufacturing method thereof