Package structures and methods of forming the same

Light-emitting component, printhead, image forming apparatus, and method for manufacturing light-emitting component

Through silicon interposer wafer and method of manufacturing the same

Method for producing wiring structure

Die-on-interposer assembly with dam structure and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Logic drive based on standardized commodity programmable logic semiconductor IC chips

Interposer with a nanostructure energy storage device

EMBEDDING COMPLEX OBJECTS WITH 3D PRINTING

Body-mountable device with a common substrate for electronics and battery

Semiconductor device and method of forming a curved image sensor

Semiconductor device and method

Ag underlayer-attached metallic member, Ag underlayer-attached insulating circuit substrate,semiconductor device, heat sink-attached insulating circuit substrate, and method for manufacturing Ag underlayer-attached metallic member

Semiconductor device and method of forming micro interconnect structures

Stacked semiconductor device structure and method

Device comprising compressed thermal interface material (TIM) and electromagnetic (EMI) shield comprising flexible portion

Embedded silicon substrate fan-out type 3D packaging structure

Electronic power module

Transferring logging data from an offset well location to a target well location

Conductive vias in semiconductor packages and methods of forming same

Semiconductor package devices integrated with inductor

Through-substrate via structure and method of manufacture

Method of manufacturing a semiconductor device including through silicon plugs

Semiconductor structure and a method of making thereof

Interposer-based damping resistor

Forming an isolation barrier in an isolator

Electronic component package

Ultra high performance interposer

Chip package with sidewall metallization

Embedded 3D interposer structure

INTEGRATION OF SILICON PHOTONICS IC FOR HIGH DATA RATE

Packages with interposers and methods for forming the same

Through-hole electrode substrate

Highly integrated RF power and power conversion based on Ga2O3 technology

Lateral vias for connections to buried microconductors and methods thereof

Fabrication method of semiconductor package with stacked semiconductor chips

Substrate structure, electronic package having the same, and method for fabricating the same

Inorganic interposer for multi-chip packaging

Package-integrated microchannels

Wrap-around source/drain method of making contacts for backside metals

Advanced node cost reduction by ESD interposer

Semiconductor structure and manufacturing method thereof

Package-on-package structures and methods for forming the same

Three dimensional integrated circuit (3DIC) with support structures

Semiconductor device and method of forming cantilevered protrusion on a semiconductor die

Semiconductor device

Metal cored solder decal structure and process

Interposer

Semiconductor device having a trench type device isolation film and method for fabricating the same

Semiconductor device with recess and method of making

Semiconductor device

Semiconductor device packages including an inductor and a capacitor

Selective solder plating

Fabrication method of substrate having electrical interconnection structures

Integrated circuits protected by substrates with cavities, and methods of manufacture

Electronic circuit board, laminated board, and method of manufacturing electronic circuit board

Semiconductor device and method for manufacturing the same

Method and apparatus for using universal cavity wafer in wafer level packaging

Microelectronic package utilizing embedded bridge through-silicon-via interconnect component and related methods

Photo-sensitive silicon package embedding self-powered electronic system

Method of producing an interposer-chip-arrangement for dense packaging of chips

Method of manufacturing wafer level chip scale package

Electrical interconnect structure for an embedded electronics package

Fabrication method of semiconductor package

Semiconductor device and method of forming a PoP device with embedded vertical interconnect units

Wafer level semiconductor device with wettable flanks

Fabrication method of electronic package

Silicon package having electrical functionality by embedded passive components

Power semiconductor module

Semiconductor device

Semiconductor device and method for manufacturing the same

Capped through-silicon-vias for 3D integrated circuits

Via and trench filling using injection molded soldering

Method of Joining Metal-Ceramic Substrates to Metal Bodies

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Contact area design for solder bonding

Semiconductor manufacturing apparatus having a pickup unit simultaneously picking up a plurality of semiconductor chips

Integrated interposer solutions for 2D and 3D IC packaging

Silicon Cooling Plate With An Integrated PCB

Body-mountable device with a common substrate for electronics and battery

Silicon package for embedded semiconductor chip and power converter

Silicon package for embedded semiconductor chip and power converter

Interposer frame and method of manufacturing the same

Method of fabricating a carrier-less silicon interposer using photo patterned polymer as substrate

Semiconductor package devices integrated with inductor

Hybrid carbon-metal interconnect structures

FABRICATION METHOD OF SEMICONDUCTOR SUBSTRATE

Semiconductor device and manufacturing method thereof

Semiconductor device having a boundary structure, a package on package structure, and a method of making

Ultra high performance interposer

Electrical interconnect structure for an embedded electronics package

Semiconductor package device including electromagnetic wave shield and method of manufacturing the same

Semiconductor package and method of fabricating the same

Mixed-signal substrate with integrated through-substrate vias

Bonded substrate, method for manufacturing the same, and support substrate for bonding

Semiconductor device

Package-on-package (PoP) device with integrated passive device in a via

Interposer having a pattern of sites for mounting chiplets

Packaging substrate and electronic package having the same

Semiconductor device package and manufacturing method thereof

High density interconnect device and method

Structure and formation method for chip package

Circuit board and manufacturing method thereof

Semiconductor device

Body-mountable device with a common substrate for electronics and battery

Compact semiconductor package and related methods

Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies

A Wide Band Gap Semiconductor Device and Its Fabrication Process

Integrated circuits protected by substrates with cavities, and methods of manufacture

Multichip module including surface mounting part embedded therein

Waveguide and semiconductor packaging

Microelectronic assemblies formed using metal silicide, and methods of fabrication

Microelectronic assemblies with cavities, and methods of fabrication

Method of fabricating a semiconductor device and the semiconductor device

Method and apparatus for using universal cavity wafer in wafer level packaging

Interposer for a package-on-package structure

3-D package having plurality of substrates

Package-on-package structures and methods for forming the same

Method and apparatus for forming multi-layered vias in sequentially fabricated circuits

Interposer and semiconductor module for use in automotive applications

Through-hole electrode substrate

Chip package and manufacturing method thereof

Integrated electronic package and stacked assembly thereof

Die-on-interposer assembly with dam structure and method of manufacturing the same

Method for creating through-connected vias and conductors on a substrate

Methods and systems for high bandwidth chip-to-chip communcations interface

Functionalized boron nitride materials and methods for their preparation and use

Integrated circuit assemblies with reinforcement frames, and methods of manufacture

Electronic package and fabrication method thereof

Interposer and electronic component

Electronic device

Interposer having stacked devices

Semiconductor device

Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package

Method of manufacturing a semiconductor device including through silicon plugs

Contact area design for solder bonding

Electronic device

Semiconductor device and manufacturing method thereof

Silicon package for embedded electronic system having stacked semiconductor chips

Compact semiconductor package and related methods

Stacked microelectronic assembly with TSVS formed in stages and carrier above chip

Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate

Decoupling MIM capacitor designs for interposers and methods of manufacture thereof

Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication

Semiconductor device

Semiconductor package and fabrication method thereof

Photo-sensitive silicon package embedding self-powered electronic system

Silicon package having electrical functionality by embedded passive components

Silicon package for embedded semiconductor chip and power converter

Package including a semiconductor die and a capacitive component

Method of fabricating semiconductor package having an interposer structure

Techniques and configurations to control movement and position of surface mounted electrical devices

Semiconductor package structure with polymeric layer and manufacturing method thereof

Semiconductor devices and methods of manufacture thereof

Package board, method for manufacturing the same and package on package having the same

Semiconductor device having a die and through-substrate via

Semiconductor packages and other circuit modules with porous and non-porous stabilizing layers

Method for fabricating a carrier-less silicon interposer

Interposer and semiconductor package with noise suppression features

Method for forming three-dimensional interconnection, circuit arrangement comprising three-dimensional interconnection, and metal film-forming composition for three-dimensional interconnection

Method for producing recesses in a substrate

Hybrid carbon-metal interconnect structures

Semiconductor devices with close-packed via structures having in-plane routing and method of making same

Semiconductor device

Semiconductor laser structure

Air gap between tungsten metal lines for interconnects with reduced RC delay

Method of fabricating a packaged integrated circuit with through-silicon via an inner substrate

Wafer level packaging method

Electrically stackable semiconductor wafer and chip packages

Methods and systems for high bandwidth chip-to-chip communications interface

Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor

Metal cored solder decal structure and process

Wiring substrate

Integrated electronic device including an interposer structure and a method for fabricating the same

Substrate having electrical interconnection structures and fabrication method thereof

Networking packages based on interposers

Method for producing at least one pad assembly on a support for the self-assembly of an integrated circuit chip on the support by the formation of a fluorinated material surrounding the pad and exposure of the pad and the fluorinated material to an ultraviolet treatment in the presence of ozone

Conductive pads and methods of formation thereof

Recessed semiconductor substrates and associated techniques

Integrated circuit assemblies with reinforcement frames, and methods of manufacture

Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication

Method for forming an electrically conductive via in a substrate

Method of forming an inductor with magnetic material

Semiconductor device with recess and method of making

Integrated interposer with embedded active devices

Wafer level chip scale package and method of manufacturing the same

Bottom package with metal post interconnections

Semiconductor device manufacturing method

Silicon-glass hybrid interposer circuitry

Chip support substrate, chip support method, three-dimensional integrated circuit, assembly device, and fabrication method of three-dimensional integrated circuit

Package assembly having a semiconductor substrate

Structure and approach to prevent thin wafer crack

Interconnect structures for substrate

Integrated circuit interposer and method of manufacturing the same

Reduced stress TSV and interposer structures

Interposer-chip-arrangement for dense packaging of chips

Carrier and a method for processing a carrier

Metal PVD-free conducting structures

Package structure and methods of forming same

Method of fabricating a semiconductor structure having conductive bumps with a plurality of metal layers

Integrated semiconductor device and method for fabricating the same

Carrier-less silicon interposer using photo patterned polymer as substrate

Semiconductor device and method for manufacturing the same

Apparatus for dicing interposer assembly

Vias in porous substrates

Method of fabricating packaging substrate having embedded through-via interposer

Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure

Semiconductor device including semiconductor chips stacked via relay substrate

Packaging substrate having embedded through-via interposer

No-flow underfill for package with interposer frame

Chip on package structure and method

Heterogeneous integration of memory and split-architecture processor

3-D package having plurality of substrates

Electronic device

Mechanism for forming patterned metal pad connected to multiple through silicon vias (TSVs)

Semiconductor substrate assembly with embedded resistance element

Through-assembly via modules and methods for forming the same

Package on wide I/O silicon

Formation of through-silicon via (TSV) in silicon substrate

Wiring board with through wiring

Interposer structure and manufacturing method thereof

CTE matched interposer and method of making

Semiconductor package and method of fabricating the same

Semiconductor device having a boundary structure, a package on package structure, and a method of making

Optical coupling module

Semiconductor devices and methods of manufacture thereof

Semiconductor packages and methods of packaging semiconductor devices

Method of providing a via hole and routing structure

Packages with interposers and methods for forming the same

Ultra high performance interposer

Semiconductor structure

Method of manufacturing a capacitor

Semiconductor devices with close-packed via structures having in-plane routing and method of making same

Die-on-interposer assembly with dam structure and method of manufacturing the same

Ball height control in bonding process

Group III nitride based flip-chip integrated circuit and method for fabricating

Parallel signal via structure

Semiconductor device, method for manufacturing same, and electronic component

Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor layers

Semiconductor package and manufacturing method thereof

Chip arrangement, and method for forming a chip arrangement

Stackable package by using internal stacking modules

Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposer

Apparatus related to an improved package including a semiconductor die

Semiconductor device, manufacturing method therefor, and electronic apparatus

Interposer device

Semiconductor device, method for manufacturing same, and electronic component

Hybrid carbon-metal interconnect structures

Module, electronic apparatus, moving object, and method of manufacturing module

Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device

Semiconductor device

Method of making package with interposer frame

Methods for bonding a hermetic module to an electrode array

Through-silicon vias and interposers formed by metal-catalyzed wet etching

Semiconductor device and manufacturing method having copper interconnects with metal film, barrier metal, and metal caps

Package on-package structures and methods for forming the same

Semiconductor device having a die and through substrate-via

System-in-package with interposer pitch adapter

Semiconductor packages and methods of packaging semiconductor devices

Inductor with magnetic material

Waveguide and semiconductor packaging

Fan-out and heterogeneous packaging of electronic components

Stacked device and method of manufacturing the same

Bump-on-trace (BOT) structures and methods for forming the same

3D-packages and methods for forming the same

Carrier-less silicon interposer

Buried TSVs used for decaps

Decoupling MIM capacitor designs for interposers and methods of manufacture thereof

Methods and systems for high bandwidth chip-to-chip communications interface

Semiconductor packages and methods of packaging semiconductor devices

Reduced stress TSV and interposer structures

Wafer leveled chip packaging structure and method thereof

Decoupling MIM capacitor designs for interposers and methods of manufacture thereof

Semiconductor module having heat dissipating portion

Semiconductor package having a cap unit with concave portion and method of manufacturing the same

Stacked microelectronic assembly with TSVS formed in stages and carrier above chip

Forming interconnect structures using pre-ink-printed sheets

Chip package using interposer substrate with through-silicon vias

Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device

Interposer having a defined through via pattern

Substrate with integrated passive devices and method of manufacturing the same

Integration of chips and silicon-based trench capacitors using low parasitic silicon-level connections

Semiconductor device and method for producing the same

Method and system for a semiconductor for device package with a die-to-packaging substrate first bond

Chip-on-wafer structures and methods for forming the same

Connector design for packaging integrated circuits

Method of forming a plurality of bumps on a substrate and method of forming a chip package

Packaged nano-structured component and method of making a packaged nano-structured component

Semiconductor substrate and fabrication method thereof

Flexible routing for chip on board applications

Interconnect structures for substrate

Semiconductor device and method of forming a PoP device with embedded vertical interconnect units

Semiconductor chip device with polymeric filler trench

Package substrate having photo-sensitive dielectric layer and method of fabricating the same

Method of shielding through silicon vias in a passive interposer

Semiconductor package, and interposer structure of the semiconductor package

Devices and methods for 2.5D interposers

Semiconductor package including interposer with through-semiconductor vias

Method of fabricating a package substrate

Flexible sized die for use in multi-die integrated circuit