207694 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered constructions; Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
Semiconductor device including resin with a filler for encapsulating bridge member connected to a substrate
#302Sense MOSFET electrically connected to a source pad via a plurality of source extraction ports
#303Power electronics assembly having flipped chip transistors
#304SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#305Plurality of lead frames for cooling a power device
#306Dual side cooling power module and manufacturing method of the same
#307Semiconductor package having a chip carrier and a metal plate sized independently of the chip carrier
#308Molded RF power package
#309Lead frame having a die pad with a plurality of grooves on an underside
#310Integrated circuit direct cooling systems having substrates in contact with a cooling medium
#311Exposed pad integrated circuit package
#312Plurality of leads between MOSFET chips
#313Semiconductor package
#314Package with an electrode-attached frame supported by a heat sink, and method for manufacturing power semiconductor module provided therewith
#315Bending semiconductor chip for connection at different vertical levels
#316Coupled semiconductor package
#317Hermetically sealed electronics module with enhanced cooling of core integrated circuit
#318Semiconductor package having die pad with cooling fins
#319Amplifier with integrated temperature sensor
#320Integrated power switching device heat sink
#321Semiconductor device and method of manufacturing the same, and power conversion device
#322Packaged high voltage MOSFET device with connection clip and manufacturing process thereof
#323Method of fabricating an electronic power module by additive manufacturing, and associated substrate and module
#324Semiconductor module
#325SEMICONDUCTOR DEVICE
#326Power semiconductor module
#327Semiconductor module and semiconductor device
#328Semiconductor device
#329Power semiconductor module
#330Integrated circuit package electronic device
#331Topside air cooling of electronic packages
#332Packaged module and metal plate
#333Multi-die-package and method
#334Chip-on-chip power card with embedded thermal conductor
#335Packaged stackable electronic power device for surface mounting and circuit arrangement
#336Compact low inductance chip-on-chip power card
#337HEATSINK FOR THERMAL RESPONSE CONTROL FOR INTEGRATED CIRCUITS
#338Power semiconductor package with improved performance
#339IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects
#340IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects
#341Semiconductor device
#342Cascode semiconductor
#343Plurality of heat sinks for a semiconductor package
#344Thermally enhanced semiconductor package with at least one heat extractor and process for making the same
#345INTERPOSER HEAT SPREADER
#346Metal tab for chip assembly
#347Semiconductor package with heat radiation board
#348Semiconductor device including an extension element for air cooling
#349Semiconductor device with frame having arms
#350IC package including multi-chip unit with bonded integrated heat spreader
#351Package with different types of semiconductor dies attached to a flange
#352Terminal member made of plurality of metal layers between two heat sinks
#353Semiconductor device including a semiconductor element and a lead frame with a plurality of holes
#354Semiconductor package having a solderable contact pad formed by a load terminal bond pad of a power semiconductor die
#355LEAD FRAME AND ASSEMBLY STRUCTURE
#356Power module package and packaging techniques
#357Semiconductor device
#358Leadframe with delamination resistant feature
#359Overmolded microelectronic packages containing knurled flanges and methods for the production thereof
#360METHOD FOR PRODUCING A CIRCUIT CARRIER, CIRCUIT CARRIER, METHOD FOR PRODUCING A SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE
#361Semiconductor assembly with conductive frame for I/O standoff and thermal dissipation
#362Power module and method of manufacturing same
#363Electronic device topside cooling
#364LOADING FRAME FOR HIGH I/O COUNT PACKAGED SEMICONDUCTOR CHIP
#365Electronic module
#366Semiconductor module and power conversion device
#367Semiconductor device
#368Semiconductor device and method for manufacturing semiconductor device
#369Power module and substrate structure applied to power modules
#370Package including multiple semiconductor devices
#371Double side heat dissipation for silicon chip package
#372Packaged device carrier for thermal enhancement or signal redistribution of packaged semiconductor devices
#373Semiconductor package structure and method for manufacturing the same
#374Semiconductor device with metal die attach to substrate with multi-size cavity
#375Semiconductor device
#376Exposed heat-generating devices
#377SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A HEAT-SINK LEAD FRAME
#378Solid state switching device
#379Half-bridge semiconductor device
#380Clips for semiconductor package and related methods
#381Bidirectional switch and bidirectional switch device including the switch
#382Semiconductor module
#383Semiconductor package with top or bottom side cooling and method for manufacturing the semiconductor package
#384Semiconductor device and a method of manufacturing a semiconductor device
#385Interconnect Clip with Angled Contact Surface and Raised Bridge Technical Field
#386Multi-chip package
#387Flippable leadframe for packaged electronic system having vertically stacked chip and components
#388Semiconductor device package assemblies and methods of manufacture
#389Semiconductor package having exposed heat sink for high thermal conductivity
#390Semiconductor light emitting device and method for manufacturing the same
#391Semiconductor packages
#392CLIPS FOR SEMICONDUCTOR PACKAGES
#393Electronic device with three dimensional thermal pad
#394Low stress asymmetric dual side module
#395IC package including multi-chip unit with bonded integrated heat spreader
#396Integrated circuit chip with a vertical connector
#397Power semiconductor device, method for manufacturing power semiconductor device, and power conversion device
#398Double-sided cooled molded semiconductor package
#399Molded semiconductor package with double-sided cooling
#400Thermal interface material having defined thermal, mechanical and electric properties
#401Semiconductor device with lead frame that accommodates various die sizes
#402Semiconductor device having component mounted on connection bar and lead on top side of lead frame and method of manufacturing semiconductor device thereof
#403Semiconductor device assemblies
#404Semiconductor device for improving heat dissipation and mounting structure thereof
#405Vertically attaching a chip to a substrate
#406Lead of semiconductor device having a side surface with a plurality of recess areas
#407Semiconductor power module
#408Semiconductor package with space efficient lead and die pad design
#409Electrical component, device and package
#410Packaging for lateral high voltage GaN power devices
#411Semiconductor package with multi-level conductive clip for top side cooling
#412Semiconductor device and method of manufacturing the same
#413Electronic module with a groove and press hole on the surface of a conductor
#414Plurality of transistor packages with exposed source and drain contacts mounted on a carrier
#415Semiconductor device having chips attached to support members through silver sintered bodies with particles
#416Leadframe systems and related methods
#417Semiconductor device with metal die attach to substrate with multi-size cavity
#418Multi-chip package with high thermal conductivity die attach
#419Semiconductor power device with corresponding package and related manufacturing process
#420Integrated circuit package with pre-wetted contact sidewall surfaces
#421Semiconductor package device and method of manufacturing the same
#422Semiconductor package and manufacturing method thereof
#423Universal surface-mount semiconductor package
#424Semiconductor package with heatsink
#425Semiconductor package
#426Semiconductor device and a method of manufacturing a semiconductor device
#427Method for fabricating an electronic module via compression molding
#428Surface mount semiconductor device with a plurality of lead frames
#429POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#430Electronic module with press hole to expose surface of a conductor
#431Power module and motor drive circuit
#432Leadframe in packages of integrated circuits
#433Interface Material Having a Polymer Ceramic
#434SEMICONDUCTOR MODULE
#435SEMICONDUCTOR PACKAGE
#436High power radio frequency amplifiers and methods of manufacture thereof
#437High power radio frequency amplifiers and methods of manufacture thereof
#438Hybrid lead frame for semiconductor die package with improved creepage distance
#439Semiconductor with external electrode
#440Semiconductor device package and method of manufacturing the same
#441High power module semiconductor package with multiple submodules
#442Dual side cooling power module and manufacturing method of the same
#443Semiconductor package having a spacer with a junction cooling pipe
#444Semiconductor package, metal sheet for use in a semiconductor package, and method for producing a semiconductor package
#445Semiconductor device
#446Plurality of cooling tubes with coolant for a power conversion package
#447Thermally enhanced semiconductor package with at least one heat extractor and process for making the same
#448Multi-die package with multiple heat channels
#449SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#450PACKAGE STRUCTURE AND PACKAGING PROCESS
#451Semiconductor package
#452Method of manufacturing semiconductor module and semiconductor module
#453Power module of double-faced cooling
#454Semiconductor package having die pad with cooling fins
#4553D-printed protective shell structures with support columns for stress sensitive circuits
#456Semiconductor package structure and assembly structure
#457Power module having heat dissipation structure
#458Multi-clip structure for die bonding
#459Semiconductor device and power conversion device
#4603-D STACKING SEMICONDUCTOR ASSEMBLY HAVING HEAT DISSIPATION CHARACTERISTICS
#461Solder mask for thermal pad of a printed circuit board to provide reliable solder contact to an integrated circuit
#462Semiconductor module
#463SEMICONDUCTOR DEVICE
#464Semiconductor device with packaging material and metal member protruding from the packaging material
#465Selective Plating of Semiconductor Package Leads
#466Method for manufacturing an electronic assembly
#467Integrated circuit package electronic device including pillar contacts and electrical terminations
#468Overmolded microelectronic packages containing knurled flanges and methods for the production thereof
#469Selective plating of semiconductor package leads
#470Stacked semiconductor die assemblies with high efficiency thermal paths and molded underfill
#471Semiconductor device, power converter, and method for manufacturing semiconductor device
#472Semiconductor device
#473Semiconductor device and method of manufacturing the same
#474Heat Dissipation Device, Semiconductor Packaging System and Method of Manufacturing Thereof
#475Lead frame assembly for a semiconductor device
#476HV converter with reduced EMI
#477Semiconductor device
#478Semiconductor device
#479Power module comprising a housing which is formed in levels
#480Chip on film package
#481Semiconductor package and manufacturing method thereof
#482SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#483Method of fabricating an electronic power module by additive manufacturing, and associated substrate and module
#484Semiconductor device
#485Packages with multiple exposed pads
#486TWO SIDED BONDABLE LEAD FRAME
#487SEMICONDUCTOR PACKAGE WITH CONTINUOUS LEAD FRAME
#488SEMICONDUCTOR DEVICE
#489Molded semiconductor package having a package-in-package structure and methods of manufacturing thereof
#490Power management application of interconnect substrates
#491Semiconductor device comprising a composite material clip
#492Semiconductor device configuring upper and lower arms including auxiliary terminals
#493ABNORMALITY DETECTION DEVICE AND POWER SUPPLY DEVICE
#494Circuit module and method of manufacturing the same
#495High performance multi-component electronics power module
#496Semiconductor power device with corresponding package and related manufacturing process
#497Semiconductor device and method for manufacturing the same
#498HV converter with reduced EMI
#499Semiconductor apparatus
#500Flat no-lead packages with electroplated edges
#501Semiconductor device, inverter unit and automobile
#502Semiconductor device
#503Package including multiple semiconductor devices
#504Integrated circuit comprising a chip formed by a high-voltage transistor and comprising a chip formed by a low-voltage transistor
#505Semiconductor package and semiconductor apparatus for use with high-frequency signals and improved heat dissipation
#506Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatus
#507Semiconductor device
#508Re-Routable Clip for Leadframe Based Product
#509Semiconductor device
#510Semiconductor module and semiconductor device
#511Semiconductor module and semiconductor device
#512HETEROJUNCTION BIPOLAR TRANSISTOR POWER AMPLIFIER WITH BACKSIDE THERMAL HEATSINK
#513Joined body, method for producing joined body, and projector
#514Semiconductor device
#515Semiconductor device and method for manufacturing semiconductor device
#516Semiconductor device and method of manufacturing the same
#517POWER MODULE AND METHOD FOR MANUFACTURING THE SAME
#518Electronic device
#519Intra-package interference isolation
#5203D-printed protective shell structures for stress sensitive circuits
#521Rectifier IC and insulation type switching power supply using the same
#522Semiconductor device
#523Dual-chip package structure
#524Power chip integration module, manufacturing method thereof, and double-sided cooling power module package
#525Semiconductor package
#526Package-in-package structure for semiconductor devices and methods of manufacture
#527Multi-phase half bridge driver package and methods of manufacture
#528Electronic device
#529Semiconductor package structure having a heat dissipation structure
#530Integrated circuit connection arrangement for minimizing crosstalk
#531Semiconductor module, electric automobile and power control unit
#532Semiconductor module, electric vehicle, and power control unit
#533Semiconductor device and method for manufacturing semiconductor device
#534Package with interconnections having different melting temperatures
#535Multi-die-package and method
#536Semiconductor device
#537Semiconductor package having an additional material with a comparative tracking index (CTI) higher than that of encapsulant resin material formed between two terminals
#538Press-fit pin and semiconductor package including the same
#539Heat sink attached to an electronic component in a packaged device
#540Connection member with bulk body and electrically and thermally conductive coating
#541Semiconductor device and manufacturing method thereof
#542Integrated circuit (IC) die attached between an offset lead frame die-attach pad and a discrete die-attach pad
#543Semiconductor device
#544Package including multiple semiconductor devices
#545Semiconductor device package and method of manufacturing the same
#546Semiconductor device
#547Thrysitor and thermal switch device and assembly techniques therefor
#548Molded air cavity packages and methods for the production thereof
#549Power conversion device
#550Power module for vehicle
#551METHODS OF DIRECT COOLING OF PACKAGED DEVICES AND STRUCTURES FORMED THEREBY
#552Semiconductor device
#553Semiconductor device
#554Power module, power semiconductor device and power module manufacturing method
#555Integrated circuit package with stress directing material
#556Polymer layers embedded with metal pads for heat dissipation
#557Electronic device and method of manufacturing the same
#558Elongated lead frame and a method of manufacturing an elongated lead frame
#559Power module and power conversion system including same
#560Semiconductor package with a heat spreader and method of manufacturing thereof
#561Molded air cavity packages and methods for the production thereof
#562PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
#563Molded air cavity packages and methods for the production thereof
#564Molded air cavity packages and methods for the production thereof
#565Semiconductor package device and method of manufacturing the same
#566Electrical component, device and package
#567Enhanced thermal transfer in a semiconductor structure
#568Manufacturing method for semiconductor device and semiconductor device
#569Method of packaging power semiconductor module including power transistors
#570Methods of direct cooling of packaged devices and structures formed thereby
#571Package for an electronic component, electronic component and electronic arrangement
#572Lead frame
#573Semiconductor device
#574Integrated circuit package with pre-wetted contact sidewall surfaces
#575Printed circuit board with insulated metal substrate made of steel
#576Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package
#577Chip on film package and heat-dissipation structure for a chip package
#578Universal surface-mount semiconductor package
#579Electronic component having a lead frame consisting of an electrically conductive material
#580Semiconductor device
#581Method of fabricating low-profile footed power package
#582Semiconductor device and method of manufacturing the same
#583Semiconductor package having junction cooling pipes embedded in substrates
#584SEMICONDUCTOR MODULE
#585Method for forming a matrix composite layer and workpiece with a matrix composite layer
#586Stacked semiconductor die assemblies with high efficiency thermal paths and molded underfill
#587Heat transfer plate having small cavities for taking up a thermal transfer material
#588Semiconductor device and lead frame
#589Semiconductor device
#590Semiconductor device and method of manufacturing the same
#591Semiconductor device, manufacturing method for semiconductor device, and electrode plate
#592Semiconductor device
#593Semiconductor device
#594Lead frame
#595Stackable power module
#596Semiconductor device
#597Package with different types of semiconductor dies attached to a flange
#598Semiconductor device, manufacturing apparatus for semiconductor device and manufacturing method for semiconductor device, and semiconductor module
#599ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#600Electronic assembly with enhanced thermal dissipation