207694 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered constructions; Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
Integrated circuit connection arrangement for minimizing crosstalk
#602Connection arrangements for integrated lateral diffusion field effect transistors
#603Leadframe and integrated circuit connection arrangement
#604Semiconductor chip package having heat dissipating structure
#605Leadframe, semiconductor package including a leadframe and method for forming a semiconductor package
#606Semiconductor device
#607Device including a compound semiconductor chip
#608Electronic device and method for manufacturing electronic device
#609Semiconductor device
#610Semiconductor package with heat slug and rivet free die attach area
#611Heterojunction bipolar transistor power amplifier with backside thermal heatsink
#612THERMAL CONDUCTIVE RESIN COMPOSITION, THERMAL CONDUCTIVE SHEET, AND SEMICONDUCTOR DEVICE
#613Semiconductor device with frame having arms and related methods
#6143-D STACKING SEMICONDUCTOR ASSEMBLY HAVING HEAT DISSIPATION CHARACTERISTICS
#615INTEGRATED SERIES SCHOTTKY DIODE RECTIFIER
#616Semiconductor device with semiconductor chips of different sizes and manufacturing method threreof
#617Semiconductor device and method with clip arrangement in IC package
#618Power electronics assembly including a circuit carrier
#619Power module of square flat pin-free packaging structure
#620Semiconductor memory device and a chip stack package having the same
#621ELECTRONIC DEVICE
#622Power module, thermal dissipation structure of the power module and contact method of the power module
#623SEMICONDUCTOR DEVICE
#624Semiconductor device and power conversion device including a bent control side frame
#625Leadframe and method of manufacturing the same
#626Method for electrically contacting a component by galvanic connection of an open-pored contact piece, and corresponding component module
#627Semiconductor device having a plurality of top surface connection terminals
#628Package-on-package structure and manufacturing method thereof
#629SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#630Semiconductor device
#631POWER FIELD-EFFECT TRANSISTOR (FET), PRE-DRIVER, CONTROLLER, AND SENSE RESISTOR INTEGRATION FOR MULTI-PHASE POWER APPLICATIONS
#632Package with interconnections having different melting temperatures
#633Semiconductor device
#634Semiconductor device, semiconductor device manufacturing method and semiconductor device mounting structure
#635LEADFRAME SUBSTRATE WITH ELECTRONIC COMPONENT INCORPORATED THEREIN AND SEMICONDUCTOR ASSEMBLY USING THE SAME
#636Rectifier IC and insulation type switching power supply using the same
#637HIGH POWER AND HIGH FREQUENCY PLASTIC PRE-MOLDED CAVITY PACKAGE
#638SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SAME
#639Electronic component package with heatsink and multiple electronic components
#640Molded power module having single in-line leads
#641Thermally conductive semiconductor device and manufacturing method thereof
#642Stacked semiconductor die assemblies with high efficiency thermal paths and molded underfill
#643Common contact leadframe for multiphase applications
#644Multi-phase common contact package
#645Method for manufacturing semiconductor device
#646Package with roughened encapsulated surface for promoting adhesion
#647Method of manufacturing a semiconductor device comprising a semiconductor chip mounted over a metal plate having an inclined surface
#648Lead frame and semiconductor package including the same
#649Semiconductor device and method of fabricating the semiconductor device
#650Semiconductor chip package having a repeating footprint pattern
#651Semiconductor device and corresponding method
#652Method of fabricating a semiconductor module with a inclined groove formed in resin side surface
#653Semiconductor chip package having heat dissipating structure
#654Power module and motor drive circuit
#655Air cavity package
#656Semiconductor device
#657Semiconductor device with solders of different melting points and method of manufacturing
#658Ring-frame power package
#659Semiconductor device
#660Power module
#661Exposed solderable heat spreader for flipchip packages
#662Signal block and double-faced cooling power module using the same
#663Double-faced cooling-type power module
#664Leadframe for a semiconductor component
#665Electronic part mounting heat-dissipating substrate
#666Electronic part mounting heat-dissipating substrate
#667METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
#668Electronic device and method of manufacturing the electronic device
#669Power conversion apparatus
#670Semiconductor module
#671Semiconductor device
#672POWER CONVERSION APPARATUS AND METHOD FOR MANUFACTURING THE SAME
#673Electronic apparatus with pocket of low permittivity material to reduce electromagnetic interference
#674Power semiconductor device
#675Power semiconductor module
#676POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME
#677Semiconductor device
#678Method for manufacturing power module
#679Semiconductor module and semiconductor driving device
#680Device with top-side base plate
#681Semiconductor device
#682Power conversion device
#683Resin-encapsulated semiconductor device
#684Semiconductor device and method of manufacturing the same
#685Power semiconductor module having a pressure application body and arrangement therewith
#686Integrated circuit package having an IC die between top and bottom leadframes
#687Semiconductor device
#688CLIP-BONDED SEMICONDUCTOR CHIP PACKAGE USING METAL BUMPS AND METHOD FOR MANUFACTURING THE PACKAGE
#689Semiconductor device
#690Integrated circuit chip with a vertical connector
#691SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SAME
#692Semiconductor devices with improved thermal and electrical performance
#693Method of fabricating low-profile footed power package
#694High power and high frequency plastic pre-molded cavity package
#695Semiconductor device, package, and vehicle
#696Flat no-lead packages with electroplated edges
#697Chip on film package
#698Semiconductor device and method for manufacturing semiconductor device
#699Semiconductor device
#700Thermally conductive sheet and semiconductor device
#701Electronic packages for flip chip devices
#702SEMICONDUCTOR DEVICE
#703Substrate structures and methods of manufacture
#704Semiconductor device with frame having arms and related methods
#705Method for fabricating stack die package
#706Semiconductor package
#707Semiconductor device and alternator using same
#708Semiconductor package with integrated heatsink
#709Super junction field effect transistor with internal floating ring
#710Semiconductor device
#711Package structure and fabricating method thereof
#712Multi-die package having different types of semiconductor dies attached to the same thermally conductive flange
#713Power management application of interconnect substrates
#714Electronic module including a device for dissipating heat generated by a semiconductor unit situated in a plastic housing and method for manufacturing an electronic module
#715Semiconductor device
#716Thermal interface material having defined thermal, mechanical and electric properties
#717Power module
#718Terminal connection structure and semiconductor apparatus
#719SEMICONDUCTOR DEVICE
#720Semiconductor device leadframe
#721Semiconductor device attached to an exposed pad
#722Functionalized interface structure
#723Apparatus and methods for PIN diode switches for radio frequency electronic systems
#724Package structure
#725Power semiconductor module for improved thermal performance
#726Multiple-unit semiconductor device
#727Semiconductor device, embedded capacitor unit, semiconductor package, and method of manufacturing embedded capacitor unit
#728Semiconductor device having terminals directly attachable to circuit board
#729Wafer-level flipped die stacks with leadframes or metal foil interconnects
#730Power overlay structure and method of making same
#731Method for manufacturing wire bonding structure, wire bonding structure, and electronic device
#732Semiconductor die substrate with integral heat sink
#733Air cavity package
#734Double Side Heat Dissipation for Silicon Chip Package
#735Semiconductor device
#736Method of fabricating integrated circuits having a recessed molding package and corresponding package
#737Semiconductor component and method of manufacture
#738Semiconductor component having group III nitride semiconductor device mounted on substrate and interconnected to lead frame
#739Heatsink very-thin quad flat no-leads (HVQFN) package
#740Flippable leadframe for packaged electronic system having vertically stacked chips and components
#741THERMAL ENHANCEMENT FOR QUAD FLAT NO LEAD (QFN) PACKAGES
#742Semiconductor device
#743Assembly comprising an element that is capable of transmitting heat, a film of a polymer that is a good thermal conductor and electrical insulator, a sintered joint and a radiator and manufacturing method
#744Thermally conductive sheet and semiconductor device
#745Devices and methods related to high power diode switches with low DC power consumption
#746Semiconductor device, semiconductor device manufacturing method and semiconductor device mounting structure
#747Method for manufacturing semiconductor device
#748Electronic device and method of manufacturing the same
#749Power semiconductor package device having locking mechanism, and preparation method thereof
#750Method of manufacturing an electronic component
#751Electronic device with periphery contact pads surrounding central contact pads
#752Semiconductor device
#753Electronic Devices with Increased Creepage Distances
#754Electronic component package including electronic component, metal member, and sealing resin
#755Semiconductor module and drive device equipped with semiconductor module
#756Molded module
#757Power module
#758Waterproof electronic device and manufacturing method thereof
#759SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#760Semiconductor device
#761Stacking arrangement for integration of multiple integrated circuits
#762High heat-dissipation chip package structure
#763Electronic power device with improved cooling
#764Semiconductor device and power converter using the same
#765Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures
#766Semiconductor module with conductive pin
#767SEMICONDUCTOR DEVICE
#768Combined packaged power semiconductor device
#769LEAD FRAME AND POWER MODULE
#770Plated terminals with routing interconnections semiconductor device
#771Power semiconductor device
#772Plated terminals with routing interconnections semiconductor device
#773Semiconductor device
#774Semiconductor device manufacturing method
#775Compound semiconductor device including a sensing lead
#776Compound semiconductor device including a multilevel carrier
#777Plated terminals with routing interconnections semiconductor device
#778Manufacturing method of chip package structure
#779Semiconductor devices including control and load leads of opposite directions
#780Semiconductor package
#781Exposed pad integrated circuit package
#782Thin semiconductor device packages
#783Semiconductor device
#784SEMICONDUCTOR ASSEMBLY AND METHOD TO FORM THE SAME
#785LEAD FRAME STRUCTURE, METHOD OF MANUFACTURING LEAD FRAME STRUCTURE, AND SEMICONDUCTOR DEVICE
#786Packaging solutions for devices and systems comprising lateral GaN power transistors
#787Packaging solutions for devices and systems comprising lateral GaN power transistors
#788INSULATING SUBSTRATE AND SEMICONDUCTOR DEVICE
#789Package module of power conversion circuit and manufacturing method thereof
#790Electronic packages for flip chip devices
#791DIODE CELL MODULES
#792Semiconductor package with multi-section conductive carrier
#793Power semiconductor device
#794Semiconductor chip package having contact pins at short side edges
#795Semiconductor package structure having a heat sink frame connected to a lead frame
#796Power semiconductor module and method for manufacturing the same
#797Electronic package structure and fabrication method thereof
#798Semiconductor stack for converter with snubber capacitors
#799DC-DC converter having terminals of semiconductor chips directly attachable to circuit board
#800Semiconductor device
#801Curable resin composition, cured product thereof, and semiconductor device using the same
#802Semiconductor device
#803Integrated circuit (IC) package with thick die pad functioning as a heat sink
#804Packaged semiconductor devices having ribbon wires
#805SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
#806Power module
#807Packaging structure
#808Power field-effect transistor (FET), pre-driver, controller, and sense resistor integration for multi-phase power applications
#809Integrated Power Assembly with Reduced Form Factor and Enhanced Thermal Dissipation
#810Assembly of an integrated circuit chip and of a plate
#811SYSTEM, APPARATUS, AND METHOD FOR SEMICONDUCTOR PACKAGE GROUNDS
#812Power module and method for manufacturing the same
#813SYSTEM, METHOD AND APPARATUS FOR LEADLESS SURFACE MOUNTED SEMICONDUCTOR PACKAGE
#814Semiconductor device
#815Method for fabricating a semiconductor package with conductive carrier integrated heat spreader
#816INTEGRATED CIRCUIT PACKAGE
#817Assemblies and methods for directly connecting integrated circuits to electrically conductive sheets
#818Semiconductor device
#819Method for manufacturing semiconductor device, and semiconductor device
#820Semiconductor device
#821Semiconductor module, semiconductor device having semiconductor module, and method of manufacturing semiconductor module
#822Electronic device provided with an encapsulation structure with improved electric accessibility and method of manufacturing the electronic device
#823Electronic device with first and second contact pads and related methods
#824Power module, power converter and drive arrangement with a power module
#825Embedded package and method thereof
#826Semiconductor device
#827Methods of forming serpentine thermal interface material and structures formed thereby
#828Method for manufacturing a chip arrangement
#829BALL GRID ARRAY PACKAGE WITH MORE SIGNAL ROUTING STRUCTURES
#830Leadframe package with integrated partial waveguide interface
#831Thin plastic leadless package with exposed metal die paddle
#832Package-in-substrate, semiconductor device and module
#833System and method for metal matrix mounting scheme
#834Matrix lid heatspreader for flip chip package
#835SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#836Exposed-Heatsink Quad Flat No-Leads (QFN) Package
#837THERMALLY CONDUCTIVE SHEET, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE
#838THERMALLY CONDUCTIVE SHEET, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE
#839Universal surface-mount semiconductor package
#840Chip having a pillar electrode offset from the bonding pad
#841Heat sink in the aperture of substrate
#842Semiconductor package and method for manufacturing the same
#843Combined packaged power semiconductor device
#844Converter having partially thinned leadframe with stacked chips and interposer, free of wires and clips
#845Semiconductor Package with Integrated Heat Spreader
#846Method for fabricating a semiconductor package with conductive carrier integrated heat spreader
#847Over-mold packaging for wide band-gap semiconductor devices
#848Power semiconductor package with multi-section conductive carrier
#849Connectable package extender for semiconductor device package
#850Semiconductor device
#851Semiconductor device, manufacturing apparatus for semiconductor device and manufacturing method for semiconductor device, and semiconductor module
#852Embedded package and method thereof
#853SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#854Method and apparatus for mounting solder balls to an exposed pad or terminal of a semiconductor package
#855Adhesive composition and adhesive sheet, and hardened article and semiconductor device using same
#856Polymer layers embedded with metal pads for heat dissipation
#857Semiconductor package with switch node integrated heat spreader
#858Low-profile footed power package
#859Power management applications of interconnect substrates
#860Semiconductor apparatus including a heat dissipating member
#861Semiconductor device and method for manufacturing semiconductor device
#862Semiconductor device and production method for same
#863Chip package structure and manufacturing method thereof
#864Protection devices
#865Semiconductor device with thick bottom metal and preparation method thereof
#866Semiconductor package with via-coupled power transistors
#867Semiconductor module package and method of manufacturing the same
#868Leadless chip carrier
#869Lead frame with radiator plate, method for manufacturing lead frame with radiator plate, semiconductor device, and method for manufacturing semiconductor device
#870SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#871Semiconductor package with integrated die paddles for power stage
#872SEMICONDUCTOR MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME
#873System-in-package module and method for forming the same
#874High power electronic component with multiple leadframes
#875SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#876Exposed die power semiconductor device
#877Package structure
#878Semiconductor device
#879Integrated circuit package
#880Embedded die redistribution layers for active device
#881Combined packaged power semiconductor device
#882High reliability semiconductor package structure
#883Semiconductor die package with pre-molded die
#884Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures
#885Converter having partially thinned leadframe with stacked chips and interposer, free of wires and clips
#886Package of power dies and three-phase power converter
#887Electronic device with heat dissipater
#888Encapsulated semiconductor device and method for manufacturing the same
#889Integrated circuit package
#890High pin count, small packages having heat-dissipating pad
#891SEMICONDUCTOR MODULE
#892Electronic Device and Method for Fabricating an Electronic Device
#893Power module package and method of manufacturing the same
#894Semiconductor device
#895Semiconductor device comprising heat dissipating connector
#896Electronic device and method for fabricating an electronic device
#897Semiconductor device and method of manufacturing a semiconductor device
#898Power overlay structure and method of making same
#899Semiconductor apparatus
#900Method for manufacturing semiconductor device, and semiconductor device