H01L23/49568 - page 4 - CPC Classification Index

#901

20150187687

2015-07-02

Semiconductor device

#902

20150187686

2015-07-02

SEMICONDUCTOR DEVICE

#903

20150187671

2015-07-02

Semiconductor device

#904

20150179556

2015-06-25

Semiconductor package and method of manufacturing the same

#905

20150162261

2015-06-11

Power semiconductor package with integrated heat spreader and partially etched conductive carrier

#906

20150162219

2015-06-11

Semiconductor device and method of manufacturing the same

#907

20150155217

2015-06-04

Semiconductor device packages and methods of manufacturing the same

#908

20150155215

2015-06-04

Electronic device with first and second contact pads and related methods

#909

20150145111

2015-05-28

Electronic component with electronic chip between redistribution structure and mounting structure

#910

20150132894

2015-05-14

Heat spreading substrate with embedded interconnects

#911

20150130036

2015-05-14

Semiconductor package with low profile switch node integrated heat spreader

#912

20150115424

2015-04-30

Electronic system comprising stacked electronic devices provided with integrated-circuit chips

#913

20150108625

2015-04-23

Semiconductor device with heat spreader

#914

20150108531

2015-04-23

METHOD OF PRODUCING A COMPONENT CARRIER, AN ELECTRONIC ARRANGEMENT AND A RADIATION ARRANGEMENT, AND COMPONENT CARRIER, ELECTRONIC ARRANGEMENT AND RADIATION ARRANGEMENT

#915

20150102486

2015-04-16

Method for mounting a chip and chip package

#916

20150102475

2015-04-16

Package structure and manufacturing method thereof

#917

20150102474

2015-04-16

Semiconductor device, semiconductor device mounting structure and power semiconductor device

#918

20150099329

2015-04-09

Packaged semiconductor device having multilevel leadframes configured as modules

#919

20150091146

2015-04-02

POWER SEMICONDUCTOR PACKAGE

#920

20150084170

2015-03-26

Semiconductor package and method of fabricating the same

#921

20150084169

2015-03-26

Semiconductor package with stress relief and heat spreader

#922

20150077941

2015-03-19

Electronic power device and method of fabricating an electronic power device

#923

20150076676

2015-03-19

POWER SEMICONDUCTOR DEVICE PACKAGE AND FABRICATION METHOD

#924

20150076674

2015-03-19

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#925

20150069590

2015-03-12

Multi-die power semiconductor device packaged on a lead frame unit with multiple carrier pins and a metal clip

#926

20150060940

2015-03-05

Electronic device

#927

20150060878

2015-03-05

Semiconductor packages having multiple lead frames and methods of formation thereof

#928

20150060872

2015-03-05

Encapsulated semiconductor device

#929

20150028462

2015-01-29

Semiconductor module

#930

20150021753

2015-01-22

Packaging structure of a semiconductor device

#931

20150016064

2015-01-15

Semiconductor device having a bulge portion and manufacturing method therefor

#932

20150014832

2015-01-15

Semiconductor Device Having Three Terminal Miniature Package

#933

20150001694

2015-01-01

INTEGRATED CIRCUIT DEVICE PACKAGE WITH THERMAL ISOLATION

#934

20150001693

2015-01-01

Leadframe pocket

#935

20150001599

2015-01-01

Power semiconductor package with non-contiguous, multi-section conductive carrier

#936

20140374891

2014-12-25

SEMICONDUCTOR DEVICE WITH HEAT SPREADER AND THERMAL SHEET

#937

20140374801

2014-12-25

Semiconductor having a normally-on nitride semiconductor transistor and a normally-off silicon semiconductor transistor provided on different metal substrates

#938

20140361420

2014-12-11

Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures

#939

20140361419

2014-12-11

Packaged power semiconductor with interconnection of dies and metal clips on lead frame

#940

20140353819

2014-12-04

Polymer layers embedded with metal pads for heat dissipation

#941

20140353814

2014-12-04

Semiconductor device and method of manufacturing semiconductor device

#942

20140345915

2014-11-27

High pin count, small SON/QFN packages

#943

20140345117

2014-11-27

SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION LEAD FRAME

#944

20140332942

2014-11-13

Method of manufacturing semiconductor device and semiconductor device

#945

20140332941

2014-11-13

System, method and apparatus for leadless surface mounted semiconductor package

#946

20140327122

2014-11-06

Micro lead frame structure having reinforcing portions and method

#947

20140312514

2014-10-23

Semiconductor device

#948

20140312480

2014-10-23

Double-side exposed semiconductor device

#949

20140312360

2014-10-23

Semiconductor power device having a heat sink

#950

20140306330

2014-10-16

Low profile leaded semiconductor package

#951

20140299979

2014-10-09

Semiconductor device and a method for manufacturing a semiconductor device

#952

20140291823

2014-10-02

Chip package and method of manufacturing the same

#953

20140291797

2014-10-02

Semiconductor Device

#954

20140264804

2014-09-18

Stack die package

#955

20140264802

2014-09-18

Semiconductor device with thick bottom metal and preparation method thereof

#956

20140264800

2014-09-18

Power overlay structure and method of making same

#957

20140264799

2014-09-18

Power overlay structure and method of making same

#958

20140264793

2014-09-18

Lead frame for semiconductor package with enhanced stress relief

#959

20140239470

2014-08-28

Resin package

#960

20140203423

2014-07-24

Semiconductor device and method for manufacturing same

#961

20140203420

2014-07-24

Method for producing semiconductor device

#962

20140197524

2014-07-17

Die package structure

#963

20140191378

2014-07-10

Integrated circuit package

#964

20140183712

2014-07-03

Ball grid array package with improved thermal characteristics

#965

20140159216

2014-06-12

Semiconductor module, semiconductor device having semiconductor module, and method of manufacturing semiconductor module

#966

20140159215

2014-06-12

Semiconductor device and method of manufacturing the same

#967

20140159212

2014-06-12

Stacked type power device module

#968

20140154843

2014-06-05

Method for top-side cooled semiconductor package with stacked interconnection plates

#969

20140151864

2014-06-05

Atomic level bonding for electronics packaging

#970

20140138803

2014-05-22

Chip arrangements and methods for manufacturing a chip arrangement

#971

20140131847

2014-05-15

Thermal performance of logic chip in a package-on-package structure

#972

20140117521

2014-05-01

Semiconductor device with thermal dissipation lead frame

#973

20140110830

2014-04-24

Semiconductor package

#974

20140110828

2014-04-24

Semiconductor packages and methods of formation thereof

#975

20140110796

2014-04-24

Semiconductor package with conductive carrier integrated heat spreader

#976

20140103902

2014-04-17

Semiconductor device having sensing functionality

#977

20140084431

2014-03-27

Semiconductor package with heat spreader

#978

20140077352

2014-03-20

Matrix lid heatspreader for flip chip package

#979

20140077345

2014-03-20

Semiconductor package, method and mold for producing same, input and output terminals of semiconductor package

#980

20140063766

2014-03-06

Lateral element isolation device

#981

20140061821

2014-03-06

Electronic device and semiconductor device

#982

20140048918

2014-02-20

Semiconductor device and method of manufacturing the same

#983

20140027891

2014-01-30

Semiconductor device and method for manufacturing semiconductor device

#984

20140008776

2014-01-09

Chip package and method of manufacturing the same

#985

20140008702

2014-01-09

Semiconductor packages having multiple lead frames and methods of formation thereof

#986

20140001628

2014-01-02

Air cavity packages having high thermal conductivity base plates and methods of making

#987

20140001624

2014-01-02

Semiconductor packages having metal composite base plates

#988

20140001620

2014-01-02

Method for manufacturing semiconductor device, and semiconductor device

#989

20140001614

2014-01-02

Thermally enhanced semiconductor package

#990

20140001480

2014-01-02

Lead Frame Packages and Methods of Formation Thereof

#991

20130341781

2013-12-26

Heat transfer member and module with the same

#992

20130337611

2013-12-19

Thermally enhanced semiconductor package with conductive clip

#993

20130320515

2013-12-05

System, method and apparatus for leadless surface mounted semiconductor package

#994

20130320514

2013-12-05

Package-in-Package for High Heat Dissipation Having Leadframes and Wire Bonds

#995

20130299848

2013-11-14

Semiconductor packages and methods of formation thereof

#996

20130285230

2013-10-31

Package for power device and method of making the same

#997

20130285221

2013-10-31

Semiconductor device with specific lead frame for a power semiconductor module

#998

20130285220

2013-10-31

Vertically packaged integrated circuit

#999

20130285132

2013-10-31

Semiconductor module with a semiconductor chip and a passive component and method for producing the same

#1000

20130277812

2013-10-24

Electronic assembly with improved thermal management

#1001

20130277761

2013-10-24

Motor control multilayer circuit board

#1002

20130270684

2013-10-17

Power module and lead frame for power module

#1003

20130256854

2013-10-03

Lead frame including an insulating resin layer entirely covering lead surface, and semiconductor device including the same

#1004

20130249051

2013-09-26

Packaged semiconductor device having multilevel leadframes configured as modules

#1005

20130241047

2013-09-19

Power semiconductor module and power unit device

#1006

20130240912

2013-09-19

Semiconductor device

#1007

20130234313

2013-09-12

Grown carbon nanotube die attach structures, articles, devices, and processes for making them

#1008

20130221516

2013-08-29

Power semiconductor module

#1009

20130214296

2013-08-22

Heat spreading substrate with embedded interconnects

#1010

20130187260

2013-07-25

Packaged semiconductor devices including pre-molded lead-frame structures, and related methods and systems

#1011

20130161803

2013-06-27

Semiconductor package with conductive heat spreader

#1012

20130134524

2013-05-30

Multi-transistor exposed conductive clip for semiconductor packages

#1013

20130126916

2013-05-23

Package for mounting electronic components, electronic apparatus, and method for manufacturing the package

#1014

20130119525

2013-05-16

Power semiconductor unit, power module, power semiconductor unit manufacturing method, and power module manufacturing method

#1015

20130113090

2013-05-09

Heat sink for electrical power converter

#1016

20130099364

2013-04-25

Top-side Cooled Semiconductor Package with Stacked Interconnection Plates and Method

#1017

20130087900

2013-04-11

Thermally Enhanced Low Parasitic Power Semiconductor Package

#1018

20130087899

2013-04-11

Diode cell modules

#1019

20130087366

2013-04-11

Power management applications of interconnect substrates

#1020

20130062745

2013-03-14

Semiconductor device, semiconductor device manufacturing method, semiconductor device mounting structure and power semiconductor device

#1021

20130056885

2013-03-07

Encapsulated semiconductor device and method for manufacturing the same

#1022

20130056861

2013-03-07

Semiconductor devices and methods of assembling same

#1023

20130049183

2013-02-28

Power device and method of packaging same

#1024

20130043574

2013-02-21

Multi-die semiconductor package with one or more embedded die pads

#1025

20130043572

2013-02-21

Integrated circuit die with low thermal resistance

#1026

20130034936

2013-02-07

Structure and method for power field effect transistor

#1027

20130026615

2013-01-31

Double-side exposed semiconductor device and its manufacturing method

#1028

20130020692

2013-01-24

Semiconductor device and method of manufacturing the same

#1029

20130015566

2013-01-17

Apparatus and methods for quad flat no lead packaging

#1030

20130012621

2013-01-10

Thermosetting resin composition, B-stage heat conductive sheet, and power module

#1031

20130001763

2013-01-03

Power device having high switching speed

#1032

20130001758

2013-01-03

Power Semiconductor Package

#1033

20120319259

2012-12-20

Power module package and method for fabricating the same

#1034

20120313229

2012-12-13

Package structure and manufacturing method thereof

#1035

20120299166

2012-11-29

Conduction path, semiconductor device using the same, and method of manufacturing conduction path, and semiconductor device

#1036

20120292753

2012-11-22

Multi-transistor exposed conductive clip for high power semiconductor packages

#1037

20120292752

2012-11-22

Thermally enhanced semiconductor package with exposed parallel conductive clip

#1038

20120236503

2012-09-20

Power semiconductor module and its attachment structure

#1039

20120217044

2012-08-30

High pin count, small SON/QFN packages having heat-dissipating pad

#1040

20120211764

2012-08-23

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

#1041

20120161632

2012-06-28

Scalable heat dissipating microelectronic integration platform (SHDMIP) for lighting solutions and method of manufacturing thereof

#1042

20120153444

2012-06-21

SEMICONDUCTOR DEVICE

#1043

20120104587

2012-05-03

Direct contact semiconductor package with power transistor

#1044

20120104586

2012-05-03

Direct contact flip chip package with power transistors

#1045

20120098111

2012-04-26

High current capacity inner leads for semiconductor devices, interposer and leadframe

#1046

20120051000

2012-03-01

Leadframe package with integrated partial waveguide interface

#1047

20120038033

2012-02-16

SEMICONDUCTOR DEVICE

#1048

20120032352

2012-02-09

Side wettable plating for semiconductor chip package

#1049

20120018890

2012-01-26

Semiconductor device

#1050

20120018762

2012-01-26

SEMICONDUCTOR DEVICE

#1051

20120012978

2012-01-19

Semiconductor device for power conversion

#1052

20120003794

2012-01-05

Thermally enhanced semiconductor package

#1053

20120001349

2012-01-05

Method of manufacturing semiconductor modules and semiconductor module

#1054

20120001308

2012-01-05

Semiconductor module and method of manufacturing the same

#1055

20110278706

2011-11-17

Power Electronic Device Package

#1056

20110260307

2011-10-27

Integrated circuit including bond wire directly bonded to pad

#1057

20110255246

2011-10-20

Rigid power module suited for high-voltage applications

#1058

20110233760

2011-09-29

Semiconductor device

#1059

20110233759

2011-09-29

SEMICONDUCTOR DEVICE

#1060

20110227208

2011-09-22

Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut

#1061

20110163428

2011-07-07

SEMICONDUCTOR PACKAGES WITH EMBEDDED HEAT SINK

#1062

20110156229

2011-06-30

Semiconductor device package having a semiconductor chip on wiring board connected to plurality of leads including power MOSFETs

#1063

20110129965

2011-06-02

Method for manufacturing semiconductor package system with die support pad

#1064

20110127658

2011-06-02

Muti Thickness Lead Frame

#1065

20110121441

2011-05-26

Diode leadframe for solar module assembly

#1066

20110084359

2011-04-14

Semiconductor device

#1067

20110075392

2011-03-31

Assemblies and Methods for Directly Connecting Integrated Circuits to Electrically Conductive Sheets

#1068

20110074007

2011-03-31

Thermally enhanced low parasitic power semiconductor package

#1069

20110073999

2011-03-31

MIXED ALLOY LEAD FRAME FOR PACKAGING POWER SEMICONDUCTOR DEVICES AND ITS FABRICATION METHOD

#1070

20110057300

2011-03-10

Direct contact leadless flip chip package for high current devices

#1071

20110049689

2011-03-03

Semiconductor device with acene heat spreader

#1072

20110042812

2011-02-24

Electronic device and method of manufacturing the same

#1073

20110042793

2011-02-24

LEAD FRAME ASSEMBLY FOR A SEMICONDUCTOR PACKAGE

#1074

20110031612

2011-02-10

Power semiconductor circuit device and method for manufacturing the same

#1075

20110006410

2011-01-13

Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device

#1076

20100315786

2010-12-16

Semiconductor device

#1077

20100302474

2010-12-02

Source driver, method for manufacturing same, and liquid crystal module

#1078

20100301496

2010-12-02

Structure and method for power field effect transistor

#1079

20100290202

2010-11-18

Semiconductor package, lead frame, and wiring board with the same

#1080

20100277873

2010-11-04

Method for manufacturing a rigid power module suited for high-voltage applications

#1081

20100237479

2010-09-23

Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

#1082

20100226095

2010-09-09

Heat conductive sheet and method for producing same, and powder module

#1083

20100213562

2010-08-26

QUAD FLAT NON-LEADED CHIP PACKAGE STRUCTURE

#1084

20100193942

2010-08-05

Thermally enhanced semiconductor package

#1085

20100193922

2010-08-05

Semiconductor chip package

#1086

20100171201

2010-07-08

CHIP ON LEAD WITH SMALL POWER PAD DESIGN

#1087

20100140718

2010-06-10

Semiconductor device

#1088

20100133670

2010-06-03

Top-side cooled semiconductor package with stacked interconnection plates and method

#1089

20100072589

2010-03-25

Semiconductor package system with die support pad

#1090

20100052121

2010-03-04

Semiconductor system-in-a-package containing micro-layered lead frame

#1091

20100035383

2010-02-11

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

#1092

20100019361

2010-01-28

Multi lead frame power package

#1093

20100015761

2010-01-21

Thermally enhanced single inline package (SIP)

#1094

20090294934

2009-12-03

Conductive clip for semiconductor device package

#1095

20090273067

2009-11-05

Multi-chip discrete devices in semiconductor packages

#1096

20090273066

2009-11-05

Semiconductor device and method

#1097

20090230522

2009-09-17

Method for producing a semiconductor device and the semiconductor device

#1098

20090230413

2009-09-17

Semiconductor light emitting device and method for manufacturing the same

#1099

20090212417

2009-08-27

Semiconductor device

#1100

20090155954

2009-06-18

Thermal enhanced low profile package structure and method for fabricating the same

#1101

20090079051

2009-03-26

Semiconductor device and manufacturing method of the same

#1102

20090026594

2009-01-29

Thin plastic leadless package with exposed metal die paddle

#1103

20080310120

2008-12-18

Electric sub-assembly

#1104

20080283984

2008-11-20

Package structure and manufacturing method thereof

#1105

20080277774

2008-11-13

POWER SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, LEAD FRAME MEMBER, AND METHOD OF MAKING POWER SEMICONDUCTOR DEVICE

#1106

20080246130

2008-10-09

Semiconductor package structure having enhanced thermal dissipation characteristics

#1107

20080230880

2008-09-25

Leadframe Array with Riveted Heat Sinks

#1108

20080173990

2008-07-24

Thermally enhanced single inline package (SIP)

#1109

20080157401

2008-07-03

Integrated circuit package with top pad

#1110

20080153190

2008-06-26

Light emitting diode package with direct leadframe heat dissipation

#1111

20080105957

2008-05-08

Thin, thermally enhanced flip chip in a leaded molded package

#1112

20080073763

2008-03-27

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#1113

20080061410

2008-03-13

Electronic device having wiring substrate and lead frame

#1114

20080054438

2008-03-06

Semiconductor package structure having multiple heat dissipation paths and method of manufacture

#1115

20080054421

2008-03-06

Integrated circuit package system with interlock

#1116

20080036072

2008-02-14

Semiconductor device and method for manufacturing a semiconductor device

#1117

20080020517

2008-01-24

Multi Lead Frame Power Package

#1118

20080017907

2008-01-24

Semiconductor module with a power semiconductor chip and a passive component and method for producing the same

#1119

20070278632

2007-12-06

Leadframe IC packages having top and bottom integrated heat spreaders

#1120

20070273010

2007-11-29

Design and Method for Attaching a Die to a Leadframe in a Semiconductor Device

#1121

20070262409

2007-11-15

Lead frame and semiconductor device using the same

#1122

20070252246

2007-11-01

Light emitting diode package with direct leadframe heat dissipation

#1123

20070241432

2007-10-18

Etched leadframe flipchip package system

#1124

20070238205

2007-10-11

Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

#1125

20070216011

2007-09-20

Multichip module with improved system carrier

#1126

20070216003

2007-09-20

Semiconductor package with enhancing layer and method for manufacturing the same

#1127

20070210438

2007-09-13

Semiconductor package

#1128

20070200223

2007-08-30

Semiconductor device and semiconductor module therewith

#1129

20070200219

2007-08-30

Power semiconductor device and method for producing it

#1130

20070193027

2007-08-23

Method of manufacturing circuit device

#1131

20070187839

2007-08-16

Integrated circuit package system with heat sink

#1132

20070164409

2007-07-19

Semiconductor package with integrated heatsink and electromagnetic shield

#1133

20070108565

2007-05-17

Etched leadframe flipchip package system

#1134

20070090513

2007-04-26

Power module fabrication method and structure thereof

#1135

20070090502

2007-04-26

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

#1136

20070085173

2007-04-19

Method and apparatus for providing double-sided cooling of leadframe-based wire-bonded electronic packages

#1137

20070075419

2007-04-05

Semiconductor device having metallic lead and electronic device having lead frame

#1138

20070001273

2007-01-04

Semiconductor device

#1139

20060263944

2006-11-23

System and method for die attach using a backside heat spreader

#1140

20060244115

2006-11-02

Chip package structure and method for manufacturing the same

#1141

20060240600

2006-10-26

Semiconductor device and method of manufacturing the same

#1142

20060237827

2006-10-26

Thermal enhanced low profile package structure

#1143

20060186533

2006-08-24

Chip scale package with heat spreader

#1144

20060175689

2006-08-10

Multi-leadframe semiconductor package and method of manufacture

#1145

20060170080

2006-08-03

Semiconductor device having directly attached heat spreader

#1146

20060131734

2006-06-22

Multi lead frame power package

#1147

20060076674

2006-04-13

Semiconductor device

#1148

20050260795

2005-11-24

Method for fabricating leadless packages with mold locking characteristics

#1149

20050258521

2005-11-24

Leadless leadframe with an improved die pad for mold locking

#1150

20050253280

2005-11-17

High heat release semiconductor and method for manufacturing the same

#1151

20050248038

2005-11-10

Chip scale package with heat spreader

#1152

20050236706

2005-10-27

Semiconductor device and hybrid integrated circuit device

#1153

20050191793

2005-09-01

Semiconductor packaging techniques for use with non-ceramic packages

#1154

20050189625

2005-09-01

Lead-frame for electonic devices with extruded pads

#1155

20050161785

2005-07-28

Semiconductor device

#1156

20050151229

2005-07-14

Electronic device having wiring substrate and lead frame

#1157

20050136640

2005-06-23

Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same

#1158

20050127483

2005-06-16

Thin, thermally enhanced molded package with leadframe having protruding region

#1159

20050121701

2005-06-09

Semiconductor device

#1160

20050110137

2005-05-26

Plastic dual-in-line packaging (PDIP) having enhanced heat dissipation

#1161

20050104168

2005-05-19

Molded leadless package having a partially exposed lead frame pad

#1162

20050104167

2005-05-19

Flip-chip type quad flat package and leadframe

#1163

20050082660

2005-04-21

Integrated circuit package with integral leadframe convector and method therefor

#1164

20050037543

2005-02-17

Method of manufacturing heat conductive substrate

#1165

18732626

2025-08-05

Structural screen window liquid metal thermal interface pad

#1166

17019333

2021-11-16

Heat dissipation substrate for multi-chip package

#1167

17011251

2021-12-28

Package structures

#1168

16126305

2019-03-26

Wiring substrate for stackable semiconductor assembly and stackable semiconductor assembly using the same

#1169

16007463

2020-07-21

Flip-chip wire bondless power device

#1170

15941424

2019-07-23

Leadframe with efficient heat dissipation for semiconductor device package assembly

#1171

15599688

2018-03-20

Power module with double-sided cooling

#1172

15385098

2017-09-12

Integrated circuits with thermal isolation and temperature regulation

#1173

15375314

2018-03-13

Stress relieved thermal base for integrated circuit packaging

#1174

15362504

2019-03-05

Enhanced thermal transfer in a semiconductor structure

#1175

15270504

2018-01-30

Top side cooling for GaN power device

#1176

15259418

2018-01-09

High voltage switch module

#1177

15054117

2017-04-11

Power module packaging with dual side cooling

#1178

14883864

2016-11-08

Wafer-level flipped die stacks with leadframes or metal foil interconnects

#1179

14850966

2016-06-28

IC package having non-horizontal die pad and lead frame therefor

#1180

14843967

2016-05-31

Semiconductor device with heat-dissipating lead frame

#1181

14842460

2016-06-21

Flat no-lead packages with electroplated edges

#1182

14569797

2016-01-19

Power module

#1183

14494880

2016-07-19

Sacrificial pad on semiconductor package device and method

#1184

14299207

2015-12-15

High speed, low loss and high density power semiconductor packages (μMaxPak) with molded surface mount high speed device(s) and multi-chip architectures

#1185

13758441

2015-11-24

Integrated circuit package with cavity in substrate