207713 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered constructions; Leads, on insulating substrates, for flat-cards, e.g. credit cards
Data carrier with a module with a reinforcement strip
#302Assembly comprising functional devices and method of making same
#303IC tag and IC tag attachment structure
#304Accessible electronic storage apparatus
#305RFID tag and method of manufacturing the same
#306RFID tag and method of manufacturing the same
#307IC card
#308Method for two-stage transfer molding device to encapsulate MMC module
#309Package structure of memory card and packaging method for the structure
#310Hybrid card
#311Semiconductor device and method for manufacturing the same, and electric appliance
#312RFID tag
#313Wireless communication devices and methods of forming and operating the same
#314Method of manufacturing a wafer assembly
#315Communication device and package thereof
#316Memory card module with an inlay design
#317Semiconductor package structure with microstrip antennan
#318Conductive pattern and method of making
#319Pattern forming structure, pattern forming method, device, electro-optical device, and electronic apparatus
#320Process for manufacture of novel, inexpensive radio frequency identification devices
#321Pattern formed structure, method of forming pattern, device, electrooptical device and electronic equipment
#322Rectifying charge storage element
#323IC card and method of manufacturing the same
#324Non-contact ID card and the like and method for manufacturing same
#325Chip module
#326Method for connecting a chip and a substrate
#327Chip module
#328Exclusive memory structure applicable for multi media card and secure digital card
#329Manufacture of RFID tags and intermediate products therefor
#330Method of manufacturing a data carrier
#331Die attach area cut-on-fly method and apparatus
#332Module for a data carrier with improved bump counterparts
#333Semiconductor device with read out prevention and method of producing same
#334Method for making a microcircuit card
#335Electric wave readable data carrier manufacturing method, substrate, and electronic component module
#336Semiconductor devices and manufacturing method therefor
#337IC card
#338Adaptable electronic storage apparatus
#339Structure package
#340Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device
#341Securities, chip mounting product, and manufacturing method thereof
#342Encapsulated chip and procedure for its manufacture
#343Semiconductor component and sensor component for data transmission devices
#344Transparent small memory card
#345Small memory card
#346Electronic circuit device, and method and apparatus for manufacturing the same
#347Semiconductor device, electronic card and pad rearrangement substrate
#348Semiconductor device, electronic card and pad rearrangement substrate
#349Electronic module having plug contacts and method for producing it
#350Radio card
#351Semiconductor device and method for fabricating the same
#352Method of manufacturing an IC coil mounted in an information carrier
#353Rectifying charge storage element
#354Method of making RFID device
#355IC module and IC card
#356Transfer assembly for manufacturing electronic devices
#357Microchip affixing probe and method of use
#358Systems and methods for saw tooth milling to prevent chip fraud
#359RFID integrated circuits with antenna contacts on multiple surfaces
#360RFID integrated circuits with antenna contacts on multiple surfaces
#361Microchip affixing probe and method of use
#362Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of forming