IC MODULES AND IC CARDS

Articles of Manufacture Relating to IC Modules and Smart Cards

SMART IC SUBSTRATE, SMART IC MODULE, AND IC CARD COMPRISING SAME

Method For Manufacturing Contactless Module Having An Antenna Coil With Finely Adjustable Inductance

CHIP MODULE AND METHOD OF FORMING SAME

Metallic chipcard having a metal label thereon

CHIP ASSEMBLY, METHOD FOR FORMING A CHIP ASSEMBLY, AND METHOD FOR USING A CHIP ARRANGEMENT

CARD HAVING A FINGERPRINT SENSOR AND MANUFACTURING METHOD OF THE SAME

SYSTEMS AND METHODS FOR SAW TOOTH MILLING TO PREVENT CHIP FRAUD

CHIP-INTERCONNECT ARRANGEMENT, METHOD FOR FORMING A CHIP-INTERCONNECT ARRANGEMENT, DOCUMENT STRUCTURE AND METHOD FOR FORMING A DOCUMENT STRUCTURE

Electric Circuit for an Electronic Chip Card Module with Colored Contacts and Method for Producing Same

Smart card with radio frequency antennas

ELECTRONIC MODULE FOR CHIP CARD

Process for manufacturing a chip-card module with soldered electronic component

Package, method for forming a package, carrier tape, chip card and method for forming a carrier tape

Chip protected against back-face attacks

PAYMENT CARD AND METHOD FOR FABRICATING THE SAME

Systems and methods for saw tooth milling to prevent chip fraud

Method for glob top encapsulation using molding tape with elevated sidewall

Foil-based package with distance compensation

Conductive trace design for smart card

SMART CARD AND MANUFACTURING METHOD THEREFOR

Glob top encapsulation using molding tape

INTEGRATED CIRCUIT CAVITY FORMATION WITH MULTIPLE INTERCONNECTION PADS

Micro module with a support structure

Methods of fabrication of chip cards and of chip card antenna supports

Foil composite card

Integrated Circuitry and Methods for Manufacturing Same

Device for removing heat

SECURE ASSEMBLY OF DOCUMENTS OR MEDIA

Wireless communication device

Packaged electronic module and manufacturing method thereof

SECURITY DEVICE SUCH THAT A SMART CARD

Power activation via conductive contact label

Display panel and display device

Method for manufacturing a smart card module and a smart card

Packaged electronic module and manufacturing method thereof

Electronic device having a plated antenna and/or trace, and methods of making and using the same

Method for manufacturing a device with integrated-circuit chip by direct deposit of conductive material

Flexible substrate structure, flexible transistor and method for fabricating the same

Flexible display apparatus having a bending area cutout

Semiconductor integrated circuit cards and communication systems including the same

Multicolored logo on smart card modules

Package substrate and semiconductor package including the same

Display panel and display device

Chip protected against back-face attacks

Rigid-flexible circuit interconnects

Chip carrier and method thereof

Strip-type substrate for producing chip card modules

Chip card module, chip card, chip card arrangement, method of forming a chip card module, and method of forming a chip card

Antenna with micro-transfer-printed circuit element

CHIP CARD SUBSTRATE AND METHOD OF FORMING A CHIP CARD SUBSTRATE

Circuit board and smart card module and smart card utilizing the same

Circuit board and smart card module and smart card utilizing the same

Integrated circuit assembly with heat spreader and method of making the same

Circuit card attachment for enhanced robustness of thermal performance

Dual-interface IC card

Strip-shaped substrate for producing chip carriers, electronic module with a chip carrier of this type, electronic device with a module of this type, and method for producing a substrate

Electronic device

FOIL COMPOSITE CARD

Foil composite card

Integrated circuitry and methods for manufacturing same

Chip carrier, a device and a method

Method for manufacturing an electrical circuit board, electrical circuit board obtained by this method and smart card comprising such an electrical circuit board

Method of manufacturing a functional inlay

Semiconductor package including barrier members and method of manufacturing the same

INTEGRATED CIRCUIT MODULE FOR A DUAL-INTERFACE SMART CARD

PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES HAVING THE PACKAGE SUBSTRATES, AND METHODS FOR FABRICATING THE SEMICONDUCTOR PACKAGES

Information processing device and communication device

Semiconductor device

Method for producing an electronic chip support, chip support and set of such supports

Microelectronic chip with multiple contacts

Semiconductor device

Semiconductor die and package jigsaw submount

Method for producing a printed circuit, printed circuit obtained by this method and electronic module comprising such a printed circuit

IC module, dual IC card, and method for manufacturing IC module

Contact smart card

Method of manufacturing a functional inlay

Smart card module, smart card, and method for producing a smart card module

Thermal management for solid-state drive

Integrated circuit module for a dual-interface smart card

Chip component mounting structure, and module component

Electronic component-mounted structure, IC card and COF package

Rigid-flexible circuit interconnects

Semiconductor device

Thermal management for solid-state drive

Tape package and flat panel display device including the same

Semiconductor package

Integrated circuit film and method of manufacturing the same

External storage device and method of manufacturing external storage device

Foil composite card

Method of manufacturing semiconductor device

RFID integrated circuits with antenna contacts on multiple surfaces

Package substrates, semiconductor packages having the package substrates

Chip package and a method for manufacturing a chip package

Systems and methods for integrating radio-frequency identification circuitry into flexible circuits

Chip card module

Semiconductor device and manufacturing method thereof

Production method of high-density SIM card package

Manufacturing method of electrical bridges suitable for reel to reel mass manufacturing

Semiconductor storage device

Multilayered film element

UNIVERSAL PRINTED CIRCUIT BOARD AND MEMORY CARD INCLUDING THE SAME

Circuit board and process for producing the same

METHOD AND SYSTEM FOR PREPARING WIRELESS COMMUNICATION CHIPS FOR LATER PROCESSING

Wireless chip and electronic appliance having the same

APPARATUS FOR FORMING A WIRELESS COMMUNICATION DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRIC DEVICE

Semiconductor device and manufacturing method of semiconductor device

Securities, chip mounting product, and manufacturing method thereof

Systems and methods for integrating radio-frequency identification circuitry into flexible circuits

Semiconductor integrated circuit, manufacturing method thereof, and semiconductor device using semiconductor integrated circuit

Memory card package structure and method for fabricating the same

RFIC chip mounting structure

Semiconductor apparatus having through vias configured to isolate power supplied to a memory chip from data signals supplied to the memory chip

Semiconductor storage device and manufacturing method thereof

SEMICONDUCTOR MEMORY CARD AND METHOD OF MANUFACTURING THE SAME

Subscriber identity module (SIM) card

Integrated battery and IC

Semiconductor package, semiconductor device, and semiconductor module

Method for producing an RFID transponder product, and RFID transponder product produced using the method

Semiconductor memory device and manufacturing the same

Semiconductor device and manufacturing method thereof

Integrated circuit card

Antenna arrangement for a chip card

Method for making contactless portable objects

IC chip, antenna, and manufacturing method of the IC chip and the antenna

System and Method To Embed A Wireless Communication Device Into Semiconductor Packages

System and Method To Embed A Wireless Communication Device Into Semiconductor Packages, including Chip-Scale Packages and 3D Semiconductor Packages

System and Method To Embed A Wireless Communication Device Into Semiconductor Packages

Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products

External storage device and method of manufacturing external storage device

Smart card module with flip-chip-mounted semiconductor chip

Paper including semiconductor device and manufacturing method thereof

Securities, chip mounting product, and manufacturing method thereof

Wireless IC device and manufacturing method thereof

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

Screened electrical device and a process for manufacturing the same

Semiconductor device having semiconductor chip within multilayer substrate

Semiconductor device and manufacturing method of semiconductor device

RFID tag

Semiconductor device with antenna

Chip carrier for a transponder module and transponder module

Placement method of an electronic module on a substrate

Flexible semiconductor device and identification label

Chip-on-board package

Semiconductor integrated circuit, manufacturing method thereof, and semiconductor device using semiconductor integrated circuit

Joint Structure Between a Wound Coil and An IC-Chip for a Noncontact RFID Device and Methods of Manufacturing The Same

Semiconductor chip, transponder and method of manufacturing a transponder

DIE ATTACH AREA CUT-ON-FLY METHOD AND APPARATUS

Apparatus for forming a wireless communication device

Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRIC DEVICE

Limiter and semiconductor device using the same

ELECTRONIC, IN PARTICULAR MICROELECTRONIC, FUNCTIONAL GROUP AND METHOD FOR ITS PRODUCTION

Method and apparatus for making a radio frequency inlay

PACKAGE, METHOD OF MANUFACTURING THE SAME AND USE THEREOF

Paper including semiconductor device and manufacturing method thereof

Apparatus for manufacturing a wireless communication device

Apparatus for preparing an antenna for use with a wireless communication device

Transfer tape strap process

Smart card heat sink

LASER ABLATION TO CREATE POCKET FOR DIE PLACEMENT

Semiconductor device

Chip module for an RFID system

Method and system for preparing wireless communication chips for later processing

Semiconductor device and manufacturing method thereof

Wireless IC device and manufacturing method thereof

Semiconductor device and method for manufacturing the same

FABRICATION METHOD OF IC INLET, ID TAG, ID TAG READER AND METHOD OF READING DATA THEREOF

Securities, chip mounting product, and manufacturing method thereof

Method of manufacturing RFID devices

Chip card for insertion into a holder

Method for producing a card-type data carrier, and data carrier produced according to this method

IC MODULE, IC INLET, AND IC MOUNTED BODY

Foil composite card

Circuit board and process for producing the same

Memory card with removable cover

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRIC DEVICE

Antifuse memory device

Semiconductor device and method for fabricating same

METHODS FOR ATTACHING A FLIP CHIP INTEGRATED CIRCUIT ASSEMBLY TO A SUBSTRATE

Tape substrate and semiconductor module for smart card, method of fabricating the same, and smart card

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRIC DEVICE

Memory device system with stacked packages

Wireless IC device and wireless IC device composite component

Semiconductor device, manufacturing method thereof, and manufacturing method of antenna

ELECTRONIC DEVICE

Method of producing electronic apparatus

Laser circuit etching by additive deposition

Semiconductor device

IC device having compact design

Noncontact information storage medium and method for manufacturing same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Semiconductor package having through holes for molding back side of package

Method and arrangement for producing a smart card

Radio frequency identification (RFID) tag lamination process using liner

Method of minimizing kerf width on a semiconductor substrate panel

Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panel

Fully integrated RF transceiver integrated circuit

Method to manufacture a silicon wafer electronic component protected against the attacks and such a component

Method for Producing a Microcircuit Card

Chip Module and Method for Producing a Chip Module

Manufacturing method of semiconductor device

Semiconductor device and manufacturing method thereof

Silicon chip having inclined contact pads and electronic module comprising such a chip

Chip module and method for producing a chip module

IC card and method of manufacturing the same

CHIP CARD MODULE AND METHOD OF PRODUCING A CHIP CARD MODULE

Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same

SD Flash Memory Card Manufacturing Using Rigid-Flex PCB

Method For Establishing an Electrical and Mechanical Connection Between Chip Contact Surfaces and Antenna Contact Surfaces and Transponder

Structure of Memory Card and the Method of the Same

Method of manufacturing an RFID tag

Semiconductor card package and method of forming the same

Method of producing antenna elements for a wireless communication device

IC card and semiconductor integrated circuit device package

Transfer assembly for manufacturing electronic devices

SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME

Accessible electronic storage apparatus

COMPLEX MEMORY CHIP, MEMORY CARD HAVING THE SAME, AND METHOD OF MANUFACTURING THE MEMORY CARD

METHOD FOR FORMING RFID TAGS

Semiconductor chips for TAG applications, devices for mounting the same, and mounting method

Card adapter for use with a storage apparatus

Accessible electronic storage apparatus for use with support frame

Semiconductor memory module having built-in antenna

Insertion-type semiconductor device and fabrication method thereof

Device having several contact areas

SEMICONDUCTOR DEVICES AND MANUFACTURING METHOD THEREFOR

Semiconductor device having a semiconductor chip enclosed by a body structure and a base

Chip having two groups of chip contacts

Paper including semiconductor device and manufacturing method thereof

Carrier module and test tray for an upright-positionable packaged chip, and testing method

Semiconductor device, electronic card and pad rearrangement substrate

Semiconductor package and method of making the same

Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device

Secure electronic entity such as a passport

IC chip, antenna, and manufacturing method of the IC chip and the antenna

Semiconductor device and manufacturing method of semiconductor device

Wireless IC tag and method for manufacturing same

Method for producing sheet with IC tags, apparatus for producing sheet with IC tags, sheet with IC tags, method for fixing IC chips, apparatus for fixing IC chips, and IC tag

Attachment method, attachment apparatus, manufacturing method of semiconductor device, and manufacturing apparatus of semiconductor device

Limiter and semiconductor device using the same

Circuit card module and method for fabricating the same

Memory module and card with integrated RFID tag

Method for manufacturing a semiconductor device using a flexible substrate

Semiconductor integrated circuit, manufacturing method thereof, and semiconductor device using semiconductor integrated circuit

RFID package structure

Transfer tape strap process

Memory card

Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component

Smart card module and substrate for a smart card module

LOW-FREQUENCY RADIO TAG ENCAPSULATING SYSTEM

CHIP CARD MODULE

Semiconductor device with antenna and separating layer

Method and device for contacting semiconductor chips

Manufacturing method for electronic device

SEMICONDUCTOR DEVICE

Method of manufacturing RFID devices

Antenna and manufacturing method thereof, semiconductor device including antenna and manufacturing method thereof, and radio communication system

Apparatus incorporating small-feature-size and large-feature-size components and method for making same

Packaging structure of RSMMC memory card

Flexible semiconductor device and identification label

Method for forming a joint

Method and apparatus for manufacturing IC chip packaged device

Method and system for manufacturing a wireless communication device

Semiconductor device

Manufacturing method for a wireless communication device and manufacturing apparatus

Apparatuses and methods for high speed bonding

Method of manufacturing a semiconductor device

Manufacturing method of electronic device

Integrated circuit device

Semiconductor memory card and method for manufacturing semiconductor memory card

Method for manufacturing semiconductor device

Chip module and chip card

Jig structure for manufacturin a stacked memory card

Substrate applicable to both wire bonding and flip chip bonding, smart card modules having the substrate and methods for fabricating the same

RFID device and method of making

Hybrid conductive coating method for electrical bridging connection of RFID die chip to composite antenna

Method of reducing warpage in an over-molded IC package

Method of preparing an antenna

Conductive pattern and method of making

Non-contact ID card and manufacturing method thereof

Heat radiation member usable with a card type electronic component and display apparatus having the same

Method of manufacturing a semiconductor device including separation by physical force

Fabrication method of IC inlet, ID tag, ID tag reader and method of reading date thereof

Inlet for an electronic tag

IC card and method of manufacturing the same

Semiconductor device and a method for manufacturing the same

Radio frequency identification (RFID) tag lamination process using liner

Radio frequency identification (RFID) tag lamination process

Wireless chip and electronic appliance having the same

Integrated circuit card and a method for manufacturing the same

Flip chip mounting substrate

Method of manufacturing semiconductor device

Integrated circuit and wireless IC tag

Method of manufacturing an electronic device

Method and system for transferring dies between surfaces

Smart card, smart card module, and a method for production of a smart card module

Method for manufacturing a thin film semiconductor device