207721 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
Semiconductor device
#302Electronic module
#303Integrated circuit devices
#304Semiconductor structure
#305Stepped interposer for stacked chip package
#306Molded power delivery interconnect module for improved Imax and power integrity
#307Multi-lead adapter
#308Semiconductor module
#309Electronic device having inverted lead pins
#310Semiconductor package and manufacturing method thereof
#3113D semiconductor device with vias and isolation layers
#312COMPOSITION AND METHOD FOR POLISHING AND INTEGRATED CIRCUIT
#313Integrated circuit chip and test method thereof
#3143D semiconductor device and structure
#315Semiconductor module
#316Power module for operating an electric vehicle drive with improved temperature determination of the power semiconductors
#317Multi-die fine grain integrated voltage regulation
#318Plurality of chips between two heat sinks
#319Power delivery structures
#320Semiconductor module and method for manufacturing the same
#321Semiconductor package, semiconductor system, and method of forming semiconductor package
#322Backside interconnect structures for semiconductor devices and methods of forming the same
#323Packages and methods of forming packages
#324Repurposed seed layer for high frequency noise control and electrostatic discharge connection
#325Semiconductor device
#326Cryogenic integrated circuits
#327Integrated circuit in hybrid row height structure
#328Integrated circuit device having active region coupled to metal layers on opposite sides of substrate, and method
#329Semiconductor module
#330Active bridging apparatus
#331Integrated circuit device including a power supply line and method of forming the same
#332Power distribution structure and method
#333Power grid, IC and method for placing power grid
#334Power electronic arrangement with a multi-phase power semiconductor module
#335Semiconductor device
#336Multilayer structure and related method of manufacture for electronics
#337Packages with metal line crack prevention design
#338Power unit, power module and inverter
#339Platform power integrity design including package standard power integrity model and compact voltage regulator module model
#340Power semiconductor device and method of manufacturing the same, and power conversion device
#341Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate
#342Power delivery device and method
#343Distributed inductance integrated field effect transistor structure
#344Defect detection structures, semiconductor devices including the same, and methods of detecting defects in semiconductor dies
#345Semiconductor module
#346Battery-free and substrate-free IoT and AI system package
#347Integrated circuit semiconductor device including through silicon via
#348Structural elements for application specific electronic device packages
#349Semiconductor packages
#3503D semiconductor device with isolation layers and oxide-to-oxide bonding
#351POWER MODULE HOUSING WITH IMPROVED PROTRUSION DESIGN
#352Cell structures and power routing for integrated circuits
#353Semiconductor component having a compressive strain layer and method for producing the semiconductor component having a compressive strain layer
#354Power semiconductor module and composite module having peripheral structures surrounding parts of the module main body
#355Photonic wafer communication systems and related packages
#356UNDERFILL MATERIAL FOR INTEGRATED CIRCUIT (IC) PACKAGE
#357Method of forming a capacitive loop substrate assembly
#358SELF-CONFIGURING CONTACT ARRAYS FOR INTERFACING WITH ELECTRIC CIRCUITS AND FABRIC CARRIERS
#359Iintegrated fan-out packages with embedded heat dissipation structure
#360Liquid jetting apparatus and wiring member
#361INTEGRATED CIRCUIT STRUCTURE
#362Semiconductor device including standard cells with combined active region
#363Semiconductor device including standard cell having split portions
#364System on chip (SOC) current profile model for integrated voltage regulator (IVR) co-design
#365ESD protection circuit cell
#366SEMICONDUCTOR DEVICE HAVING STACKED CHIPS
#367Semiconductor integrated circuit device and semiconductor package structure
#368INTEGRATED CIRCUIT, AND MOTOR DEVICE INCLUDING THE SAME
#369METHOD FOR COMPENSATING VOLTAGE DROP WITH ADDITIONAL POWER MESH AND CIRCUIT SYSTEM THEREOF
#3703D chip sharing data bus
#371Stacked IC structure with orthogonal interconnect layers
#372Planar power module with spatially interleaved structure
#373Header layout design including backside power rail
#374Contactless Communication Module
#375Methods and systems for matching both dynamic and static parameters in dies, discretes, and/or modules, and methods and systems based on the same
#376Assortment of substrates for semiconductor circuits, corresponding assortment of devices and method
#377Integrated circuit packages with conductive element having cavities housing electrically connected embedded components
#378Power Distribution
#379True power shedding
#380High speed, high density, low power die interconnect system
#381HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM
#382Semiconductor chip
#383Reconfigurable memory architectures
#384Power device module with dummy pad die layout
#385Semiconductor device
#386Semiconductor package and method
#387Circuit wiring techniques for stacked transistor structures
#388Electronic device comprising a chip and at least one SMT electronic component
#3893D chip with shared clock distribution network
#390Semiconductor module
#391Electronic device and method for manufacturing same
#392Method and IC design with non-linear power rails
#393Semiconductor device and method of manufacture
#394Integrated circuits with backside power rails
#395Power amplifier systems with control interface and bias circuit
#396High density substrate routing in package
#397Package level power gating
#398Memory array decoding and interconnects
#399Semiconductor module structure
#400Semiconductor integrated circuit device
#401Printed board and semiconductor device
#402Power inverter module with reduced inductance
#403Power module
#404Semiconductor structures
#405Packaged die stacks with stacked capacitors and methods of assembling same
#406Electronic-component-mounted module design to reduce linear expansion coefficient mismatches
#407Stacked semiconductor device assembly in computer system
#408Connection terminal pattern and layout for three-level buck regulator
#409System-in-package with double-sided molding
#410Connection of several circuits of an electronic chip
#411Package structure and method of forming thereof
#412Sensor unit
#413Passivation scheme for pad openings and trenches
#414EMI shielding for flip chip package with exposed die backside
#415Signal routing in integrated circuit packaging
#416External connector of semiconductor module, method for manufacturing external connector of semiconductor module, semiconductor module, vehicle, and method for connecting external connector to bus bar
#417Three-dimensional integrated package device for high-voltage silicon carbide power module
#418Stack packages including an interconnection structure
#419Semiconductor package with layer structures, antenna layer and electronic component
#420Integrated circuits with backside power rails
#421Integrated circuit chip design for symmetric power delivery
#422Integrated device for protection from electrostatic discharges
#423Semiconductor device and method of forming a 3D interposer system-in-package module
#424Low impedance multi-conductor layered bus structure with shielding
#425Integrated circuit with backside power delivery network and backside transistor
#426Semiconductor device
#427NANOSTRUCTURE ENERGY STORAGE AND ELECTRONIC DEVICE
#428ELECTRONIC MODULE FOR POWER CONTROL
#429Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#430Power semiconductor module with power semiconductor switches
#431Multi-lead adapter
#432Semiconductor package
#433Electronic device and method for manufacturing same
#434Condensation resistant power semiconductor module
#435Semiconductor device
#436Semiconductor packages and manufacturing methods thereof
#437Semiconductor device with shielding structure for cross-talk reduction
#438Over and under interconnects
#439Power integrated module
#440Semiconductor device
#441Semiconductor apparatus, power conversion device, and method for manufacturing semiconductor apparatus
#442Electronic device having inverted lead pins
#443Integrated circuit including standard cell
#4443D chip with shared clock distribution network
#445Circuit wiring techniques for stacked transistor structures
#446On-die capacitor
#447Power phase module of a converter, converter, and vehicle
#448Power grid, IC and method for placing power grid
#449Apparatus and method of forming backside buried conductor in integrated circuit
#450Power shared cell architecture
#451Stacked IC structure with system level wiring on multiple sides of the IC die
#452Low-impedance bus assemblies and apparatus including the same
#453Semiconductor device
#454External connection part of semiconductor module, semiconductor module, external connection terminal, and manufacturing method of external connection terminal of semiconductor module
#455Busbar assembly
#456Semiconductor device and power conversion device
#457Semiconductor device having electrode pads arranged between groups of external electrodes
#458Organic light emitting diode display device
#459Semiconductor devices and semiconductor structures
#460Semiconductor arrangements
#4613D semiconductor device with isolation layers
#462Very thin embedded trace substrate-system in package (SIP)
#463Liquid jetting apparatus and wiring member
#464System-in-package with double-sided molding
#4653D chip sharing power interconnect layer
#466Power network and method for routing power network
#467SEMICONDUCTOR MODULE
#468Analysis system, analysis method, and program storage medium
#469Capacitance balance in dual sided contact switch
#470Face-to-face mounted IC dies with orthogonal top interconnect layers
#471Semiconductor module bonding structure and bonding method
#472Semiconductor package with elastic coupler and related methods
#473Memory array decoding and interconnects
#474Packaged semiconductor system having unidirectional connections to discrete components
#475Circuit overvoltage protection
#476Power conversion device including a plurality of semiconductor modules
#477Semiconductor packages
#478Flipped vertical field-effect-transistor
#479System on chip (SOC) current profile model for integrated voltage regulator (IVR) co-design
#480Semiconductor device and electronic device
#481Integrated circuit and electronic circuit comprising the same
#482Package module
#483Integration of a programmable device and a processing system in an integrated circuit package
#484Packaging structure for power module
#485Circuit module
#486Heat radiating member and electrical junction box
#487Connection system of semiconductor packages using a printed circuit board
#488Semiconductor device having stacked chips
#489Integrated circuit electrostatic discharge bus structure and related method
#490Semiconductor module mounted on a cooling device for use in a vehicle
#491Method and IC design with non-linear power rails
#492Oscillator, electronic apparatus and vehicle
#493Integrated circuit device including a power supply line and method of forming the same
#494Buried power rail and method forming same
#495Cell having stacked pick-up region
#496Packages and methods of forming packages
#497Semiconductor equipment
#498Semiconductor device
#499Semiconductor device with discrete blocks
#500Stacked semiconductor device assembly in computer system
#501Redistribution metal and under bump metal interconnect structures and method
#502High-speed semiconductor modules
#503Shielded package assemblies with integrated capacitor
#504Power network having power switch units composing rhombus area
#505Switching Device for Switching High Voltages for Cable Testing via the Application of High Voltage to a Test Cable and Discharge of the Test Cable
#506Multi-layer embedded magnetic inductor coil
#507Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#508Semiconductor device
#509Signal delivery in stacked device
#510Multi-terminal inductors for voltage regulators
#511Anisotropic conductive sheet and method for manufacturing the same
#512EMI shielding for flip chip package with exposed die backside
#513Electronic components for soft, flexible circuitry layers and methods therefor
#514Post-grind die backside power delivery
#515ELECTRONIC SYSTEM PROVIDED WITH A PLURALITY OF INTERCONNECTED ELECTRONIC FUNCTIONS
#516Semiconductor package with filler particles in a mold compound
#517Multiple sized bump bonds
#518Integrated circuit pin, in-cell touch panel, and method of encapsulating integrated circuit pin
#519Multi-die fine grain integrated voltage regulation
#520Wafer level integration of passive devices
#521Power module
#522Method and device for power rail in a fin type field effect transistor
#523Semiconductor device assemblies including multiple shingled stacks of semiconductor dies
#524Power conversion apparatus
#525Semiconductor die assembly having a heat spreader that extends through an underlying interposer and related technology
#526Non-embedded silicon bridge chip for multi-chip module
#527Semiconductor integrated circuit device
#528Integrated circuit, circuit board with integrated circuit, and display device using the same
#529Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#530Integrated fan-out packages with embedded heat dissipation structure
#531Thermal interface material layer and package-on-package device including the same
#532Integrated circuit including multi-height standard cell and method of designing the same
#533High density substrate routing in package
#534PACKAGED SEMICONDUCTOR DEVICES WITH MULTI-USE INPUT CONTACTS AND RELATED METHODS
#535Electronic device with relay mounted to substrate
#536Nanostructure energy storage and electronic device
#537Switching device
#538Chip on film package
#539Semiconductor device having a diode formed in a first trench and a bidirectional zener diode formed in a second trench
#540Electronic components for soft, flexible circuitry layers and methods therefor
#541Semiconductor device, cooling module, power converting device, and electric vehicle
#5423D semiconductor device with isolation layers
#543Managed integrated circuit power supply distribution
#544Signal routing in integrated circuit packaging
#545Compositions of influenza hemagglutinin with heterologous epitopes and/or altered maturation cleavage sites and methods of use thereof
#546Method, apparatus and system to interconnect packaged integrated circuit dies
#547Power management application of interconnect substrates
#548Structure and method for flexible power staple insertion
#549Microelectronic devices designed with capacitive and enhanced inductive bumps
#550Voltage noise reduction of power delivery networks for integrated circuits
#551Wiring with external terminal
#552Semiconductor device
#553Apparatus for true power shedding via switchable electrical connections
#554Package film having foil layers with intervening multilayer structure
#555Sn whisker growth mitigation using NiO sublayers
#556Bus bar structure and power conversion apparatus using the same
#557Decoupling capacitor mounted on an integrated circuit die, and method of manufacturing the same
#558Power semiconductor device and package
#559Embedded electronics package with multi-thickness interconnect structure and method of making same
#560Antifuse memory arrays with antifuse elements at the back-end-of-line (BEOL)
#561Metal interconnect fuse memory arrays
#562Integrated circuit package substrate
#563Semiconductor packaging structure
#564Semiconductor integrated circuit device
#565Semiconductor packages
#566Hybrid metallization interconnects for power distribution and signaling
#567Electronic device having inverted lead pins
#568Semiconductor device, inverter unit and automobile
#569Power semiconductor module
#570Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#571Capacitor built-in multilayer wiring substrate and manufacturing method thereof
#572Power conversion device
#573Reduced area eFuse cell structure
#574Multilayer structure and related method of manufacture for electronics
#575Integrated circuit including standard cell
#576EXPOSING CIRCUITRY FOR DIE TESTING
#577Power management integrated circuit with bleed circuit control
#578Power management integrated circuit with bleed circuit control
#579Capacitor loop structure
#580Power semiconductor device
#581Power semiconductor module
#582Passivation scheme for pad openings and trenches
#583Semiconductor device and method of manufacturing semiconductor device
#584Semiconductor integrated circuit and clock supply method including a sample and hold circuit
#585Vertical transistor static random access memory cell
#586Semiconductor device
#587IC CARD
#588Ring-in-ring configurable-capacitance stiffeners and methods of assembling same
#589Semiconductor device
#590Semiconductor device with shielding structure for cross-talk reduction
#591Semiconductor package with elastic coupler and related methods
#592Device and method for reducing contact resistance of a metal
#593Semiconductor package
#594Land grid array package extension
#595Semiconductor device assemblies including multiple shingled stacks of semiconductor dies
#596Semiconductor device manufacturing method including forming a wide portion spreading over a looped portion
#597Integrated circuit, and motor device including the same
#598Silicon carbide power module
#599Package stiffener for protecting semiconductor die
#600Electronic device and method for manufacturing same