207721 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
VERTICAL RESISTOR BUFFERED MULTIPLEXER BUSKEEPER
#602Connection terminal assembled body and circuit board using same connection terminal assembled body
#603Semiconductor package
#604Power mesh-on-die trace bumping
#605And placement of de-coupling capacitors for PDN design
#606THIN FILM PASSIVE DEVICES INTEGRATED IN A PACKAGE SUBSTRATE
#607Non-planar gate thin film transistor
#608Electronic assembly with a direct bonded copper substrate
#609Semiconductor package with filler particles in a mold compound
#610Semiconductor device and method of manufacture
#611Reducing tip-to-tip distance between end portions of metal lines formed in an interconnect layer of an integrated circuit (IC)
#612INTEGRATED CIRCUIT PACKAGE AND FASTENER
#613Power conversion apparatus
#614Method of fabricating integrated circuit
#615Semiconductor device and method of forming substrate including embedded component with symmetrical structure
#616Multi terminal capacitor within input output path of semiconductor package interconnect
#617High density package interconnects
#618Integrated circuit package substrate
#619Non-embedded silicon bridge chip for multi-chip module
#620Power amplifier modules including transistor with grading and semiconductor resistor
#621Semiconductor logic device and system and method of embedded packaging of same
#622Semiconductor logic device and system and method of embedded packaging of same
#623Semiconductor device
#624Semiconductor packages
#625Stacked semiconductor apparatus and semiconductor system
#626Managed integrated circuit power supply distribution
#627Integrated fan-out packages with embedded heat dissipation structure
#628Rlink-on-die interconnect features to enable signaling
#629Mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuits
#630Semiconductor device assemblies including multiple shingled stacks of semiconductor dies
#631High density substrate routing in package
#632Stacked radio frequency devices
#633Combined electrode and three-level high-power module thereof
#634Packaged semiconductor system having unidirectional connections to discrete components
#635Multi-row wiring member for semiconductor device and method for manufacturing the same
#636Gas sensor packages
#637Power semiconductor module with partially coated power terminals and method of manufacturing thereof
#638Liquid jetting apparatus and wiring member
#639Semiconductor device
#640Redistribution metal and under bump metal interconnect structures and method
#641Packaging devices and methods for semiconductor devices
#642Semiconductor device with high quality and reliability wiring connection, and method for manufacturing the same
#643Power distribution network of integrated circuit
#644Systems, methods, and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate package
#645Reconfigurable memory architectures
#646Packages and methods of forming packages
#647Semiconductor package with terminal pattern for increased channel density
#648Electronic packages with stacked sitffeners and methods of assembling same
#649Ring-in-ring configurable-capacitance stiffeners and methods of assembling same
#650INTEGRATED EMBEDDED SUBSTRATE AND SOCKET
#651Electrode connection structure, lead frame, and method for forming electrode connection structure
#652Semiconductor devices and methods for enhancing signal integrity of an interface provided by a semiconductor device
#653Semiconductor device having stacked chips
#654Very thin embedded trace substrate-system in package (SIP)
#655Integration of a programmable device and a processing system in an integrated circuit package
#656Via architecture for increased density interface
#657Flipped vertical field-effect-transistor
#658Power module
#659Methods of operating microelectronic devices including a controller
#660Memory Circuits and Routing of Conductive Layers Thereof
#661Multi-row wiring member for semiconductor device and method for manufacturing the same
#662Stacked semiconductor device assembly in computer system
#663Integrated circuit layout wiring for multi-core chips
#664Method and IC design with non-linear power rails
#665HYBRID ADDITIVE STRUCTURE STACKABLE MEMORY DIE USING WIRE BOND
#666Electronic device and method of manufacturing the same
#667Weld joint with constant overlap area
#668Semiconductor packages with electromagnetic interference shielding
#669Semiconductor package
#670Semiconductor integrated circuit device
#671Interposer with a nanostructure energy storage device
#672Semiconductor device having electrode pads arranged between groups of external electrodes
#673Method for manufacturing resin-sealed power semiconductor device
#674Semiconductor chip including a plurality of pads
#675Packaged module having a ball grid array with grounding shielding pins for electromagnetic isolation, method of manufacturing the same, and wireless device comprising the same
#676Interposer for an integrated system and corresponding design method
#677Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#678Electronics package with integrated interconnect structure and method of manufacturing thereof
#679Power converter
#680Antenna module and method of manufacturing the same
#681Image sensor having phase difference detection pixel
#682ANTENNA DIODE CIRCUIT
#683Semiconductor package, package on package structure and method of froming package on package structure
#684Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows
#685Wafer-scale power delivery
#686Package structure, integrated fan-out package and method of fabricating the same
#687Power converter with switching control
#688Method, apparatus and system to interconnect packaged integrated circuit dies
#689Input/output cell wire connector
#6903D semiconductor device and structure
#691Organic light-emitting diode (OLED) array substrate and manufacturing method thereof and display device
#692SEMICONDUCTOR PACKAGES
#693Wafer-level packaging for enhanced performance
#694Wafer-level packaging for enhanced performance
#695Display baseplate and preparation method thereof, and display device
#696Compact bypass and decoupling structure for millimeter-wave circuits
#697Display device
#698Power gating for three dimensional integrated circuits (3DIC)
#699I/O layout footprint for multiple 1LM/2LM configurations
#700Semiconductor package and method
#701Packaged die stacks with stacked capacitors and methods of assembling same
#702Transistor assemblies
#703Transistor packages
#704Molded package with chip carrier comprising brazed electrically conductive layers
#705Offset test pads for WLCSP final test
#706Printed circuit board and semiconductor package structure
#707Printed circuit board and semiconductor package structure
#708Printed circuit board and semiconductor package structure
#709Semiconductor die assembly having heat spreader that extends through underlying interposer and related technology
#710Multi-die fine grain integrated voltage regulation
#711Semiconductor packages
#712Semiconductor device and method for manufacturing the same
#713Contactless Communication Module
#714Over-molded IC packages with embedded voltage reference plane and heater spreader
#715Semiconductor device
#716Configuration element for printed circuit board assemblies
#717Semiconductor package and manufacturing method thereof
#718Semiconductor device
#719Semiconductor package, semiconductor device and semiconductor device manufacturing method
#720Integrated circuit packages with conductive element having cavities housing electrically connected embedded components
#721Semiconductor package
#722Interposer-based damping resistor
#723Semiconductor device and method of controlling the semiconductor device
#724Compositions of influenza hemagglutinin with heterologous epitopes and/or altered maturation cleavage sites and methods of use thereof
#725SEMICONDUCTOR CHIP COMPRISING AN IOPAD FOR ELIMINATING ON-BOARD AND DISCRETE COMPONENTS
#726Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows
#727Face-to-face mounted IC dies with orthogonal top interconnect layers
#728Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contacts and contact pins of package devices
#729Stacked IC structure with system level wiring on multiple sides of the IC die
#730Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices
#731Microprocessor package with first level die bump ground webbing structure
#732Wafer-scale power delivery
#733ELECTRONIC DEVICE
#7343D chip sharing power circuit
#735Igniter
#736Semiconductor devices including a controller and methods of forming such devices
#737Post-grind die backside power delivery
#738Circuitized substrate with electronic components mounted on transversal portion thereof
#739Circuitized substrate with electronic components mounted on transversal portion thereof
#740Semiconductor device and semiconductor package including plural solder ball sets each corresponding to a pair of differential input and differential output signals
#741Power semiconductor arrangement having a stack of connection plates
#742Semiconductor device with discrete blocks
#743System in package module assembly, system in package module, and electronic device
#744Integration of a passive component in an integrated circuit package
#745Integration of a passive component in a cavity of an integrated circuit package
#746Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#747Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#748Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#7493D semiconductor device
#750Stacked package assembly with voltage reference plane
#751Semiconductor device, method for manufacturing semiconductor device, and interface unit
#752Semiconductor integrated circuit device
#753Microelectronic package having a passive microelectronic device disposed within a package body
#754Power mesh-on-die trace bumping
#755Integrated circuit package with microstrip routing and an external ground plane
#756Semiconductor device and method of manufacturing thereof
#757Semiconductor device and method for manufacturing the same
#758Semiconductor device
#759DECOUPLING ARRANGEMENT
#760Transistor with integrated active protection
#761System-in-package with double-sided molding
#762PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#763Semiconductor device and method of forming a 3D interposer system-in-package module
#764Circuit overvoltage protection
#765Semiconductor device
#766Isolating electric paths in semiconductor device packages
#767METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
#768Semiconductor device including a cylindrical electrode inserted into a looped portion of an electrode
#769Lead frame
#770Die-to-die interface configuration and methods of use thereof
#771ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS
#772Semiconductor module
#773Integrated circuit including standard cell
#774Semiconductor integrated circuit including discharge control circuit
#775Flipped vertical field-effect-transistor
#776Semiconductor module comprising transistor chips, diode chips and driver chips arranged in a common plane
#777Power distribution
#778Semiconductor circuit
#7793D integrated circuit device
#780Electronic device and semiconductor device
#781Multiple driver pin integrated circuit structure
#782Reducing tip-to-tip distance between end portions of metal lines formed in an interconnect layer of an integrated circuit (IC)
#783Packages with metal line crack prevention design
#784Semiconductor device
#785Semiconductor device
#786Semiconductor device, chip module, and semiconductor module
#787High speed, high density, low power die interconnect system
#788Wiring with external terminal
#789Display apparatus and fabricating method thereof
#790Thermal interface material on package
#791Physical design in magnetic environment
#792Interconnect circuits at three-dimensional (3-D) bonding interfaces of a processor array
#793Semiconductor integrated circuit cards and communication systems including the same
#794Semiconductor device
#795Semiconductor device
#796High density package interconnects
#797Resin circuit board and resin circuit board having component mounted thereon
#798Standard cell circuits employing voltage rails electrically coupled to metal shunts for reducing or avoiding increases in voltage drop
#799Packaging devices and methods for semiconductor devices
#800Memory device and method of disposing conduction lines of the same
#801Power semiconductor packages having a substrate with two or more metal layers and one or more polymer-based insulating layers for separating the metal layers
#802Semiconductor device
#803Device and method for reducing contact resistance of a metal
#804ESD protection circuit cell
#805Wireless package with antenna connector and fabrication method thereof
#806Semiconductor device
#807Power grid, IC and method for placing power grid
#808Packaged semiconductor devices with multi-use input contacts and related methods
#809Semiconductor device with stacked terminals
#810Semiconductor device
#811Lead frame
#812Active interface resistance modulation switch
#813Capacitor mounting structure
#814Method for electrically contacting a component by galvanic connection of an open-pored contact piece, and corresponding component module
#815THROUGH-SILICON VIA BASED SEMICONDUCTOR PACKAGE
#816Nano-wire resistance model
#817Semiconductor device including vertical channel
#818Semiconductor device
#819Power conversion device with staggered power semiconductor modules
#820High density substrate routing in package
#821Semiconductor device having a plurality of top surface connection terminals
#822Thermal interface material layer and package-on-package device including the same
#823Electronic component mounting package and electronic device using the same
#824Package structure with inductor and method of forming thereof
#825Integrated circuit package substrate
#826High-frequency module
#827VERTICAL TRANSISTORS WITH MERGED ACTIVE AREA REGIONS
#828Integrated circuit module and method of forming same
#829Flipped vertical field-effect-transistor
#830Microelectronic system including printed circuit board having improved power/ground ball pad array
#831Circuit boards and circuit board assemblies
#832Chip package structure and manufacturing method thereof
#833PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#834Staged via formation from both sides of chip
#835Manufacturing method of package-on-package structure
#836Molded intelligent power module
#837TUNABLE THREE DIMENSIONAL INDUCTOR
#838Programmable frequency selective surfaces
#839Semiconductor device method of manufacture
#840Semiconductor device and display device
#841Backlighting dimming circuit and liquid crystal display
#842Semiconductor device, system in package, and system in package for vehicle
#843Semiconductor device having stacked chips
#844Power module assembly with reduced inductance
#845Electrical connectivity of die to a host substrate
#846Chip package and package substrate
#847Thermal resistance analysis model and semiconductor integrated circuit
#848Visible alignment markers/landmarks for CAD-to-silicon backside image alignment
#849Semiconductor device
#850Shielded package assemblies with integrated capacitor
#851Multi terminal capacitor within input output path of semiconductor package interconnect
#852Memory metal scheme
#853Marked pixel unit, display device using the same, and method for fabricating the display device
#854Electronic component
#855Semiconductor device and method of forming substrate including embedded component with symmetrical structure
#856Method for compensating for temperature effects in semiconductor device structures using a diode structure and a tunable resistor
#857Multi terminal capacitor within input output path of semiconductor package interconnect
#858Multi-layer filled gate cut to prevent power rail shorting to gate structure
#859PRE-BUMPED REDISTRIBUTION LAYER STRUCTURE AND SEMICONDUCTOR PACKAGE INCORPORATING SUCH PRE-BUMPED REDISTRIBUTION LAYER STRUCTURE
#860Display device
#861Power gating for three dimensional integrated circuits (3DIC)
#862SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#863Thermal interface material on package
#864Electronic device
#865Semiconductor device
#866Semiconductor integrated circuit device
#867Multiple driver pin integrated circuit structure
#868Ceramic substrate and method for producing a ceramic substrate
#869Electronic device
#870High current high power solid state relay
#871Substrate unit
#872Semiconductor device
#873FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES
#874Ultrasonic probe
#875Nonvolatile memory devices and methods forming the same
#876Semiconductor module
#877Semiconductor device
#878SUBSTRATE WITH SUB-INTERCONNECT LAYER
#879Semiconductor device and semiconductor chip
#880Tamper detection for a chip package
#881Layout method for integrated circuit and layout of the integrated circuit
#882Capacitive interconnect in a semiconductor package
#883Methods of manufacturing a semiconductor device package including a controller element
#884Molded interconnect device, manufacturing method for molded interconnect device, and circuit module
#885Semiconductor device substrate, semiconductor device wiring member and method for manufacturing them, and method for manufacturing semiconductor device using semiconductor device substrate
#886Semiconductor device and method for designing a semiconductor device
#887Power commutation module
#888Power module with dummy terminal structure
#889Power semiconductor module and electric power steering apparatus using the same
#890Manufacturing method of semiconductor package and manufacturing method of semiconductor device
#891Crosstalk reduction in electrical interconnects
#892ELECTRONIC CIRCUIT COMPONENT
#893Molded package
#894Low stress integrated device packages
#895Packaged semiconductor devices with multi-use input contacts and related methods
#896Semiconductor device and power module
#897Electronic substrates and interposers made from nanoporous films
#898Semiconductor packaging structure and semiconductor power device thereof
#899Electronic part mounting heat-dissipating substrate
#900Flipped vertical field-effect-transistor